Inventor · disambiguated record
Yasuhiro Kasama
Also filed as: KASAMA YASUHIRO
24 granted patents·688 citations·filing 1988–2008
97Inventor score
Top patents by PatentIndex Score
24 records- 0194US5332922AMulti-chip semiconductor packageHITACHI LTD·Filed 1991·Granted Jul 26, 1994·158 cites·16 claims
- 0291US5208782ASemiconductor integrated circuit device having a plurality of memory blocks and a lead on chip (LOC) arrangementHITACHI LTD·Filed 1992·Granted May 4, 1993·133 cites·28 claims
- 0387US7499340B2Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2008·Granted Mar 3, 2009·8 cites·18 claims
- 0485US6515913B2Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2001·Granted Feb 4, 2003·22 cites·5 claims
- 0584US6335884B1Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2000·Granted Jan 1, 2002·22 cites·5 claims
- 0682US6212089B1Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2000·Granted Apr 3, 2001·18 cites·5 claims
- 0782US5701031ASealed stacked arrangement of semiconductor devicesHITACHI LTD·Filed 1994·Granted Dec 23, 1997·58 cites·16 claims
- 0881US7203101B2Semiconductor memory device and defect remedying method thereofHITACHI ULSI SYS CO LTD·Filed 2006·Granted Apr 10, 2007·5 cites·6 claims
- 0978US7345929B2Semiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 2007·Granted Mar 18, 2008·4 cites·10 claims
- 1076US5602771ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1993·Granted Feb 11, 1997·43 cites·11 claims
- 1176US5579256ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1995·Granted Nov 26, 1996·45 cites·6 claims
- 1274US6657901B2Semiconductor device formed in a rectangle region on a semiconductor substrate including a voltage generating circuitHITACHI LTD·Filed 2002·Granted Dec 2, 2003·11 cites·41 claims
- 1373US4941129ASemiconductor memory deviceHITACHI LTD·Filed 1988·Granted Jul 10, 1990·24 cites·12 claims
- 1471US6898130B2Semiconductor memory device and defect remedying method thereofHITACHI VLSI ENG·Filed 2003·Granted May 24, 2005·9 cites·6 claims
- 1570US7016236B2Semiconductor memory device and defect remedying method thereofHITACHI ULSI SYS CO LTD·Filed 2005·Granted Mar 21, 2006·2 cites·10 claims
- 1669US6049500ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1998·Granted Apr 11, 2000·28 cites·10 claims
- 1764US5043947ASemiconductor memory deviceHITACHI LTD·Filed 1990·Granted Aug 27, 1991·20 cites·9 claims
- 1860US6160744ASemiconductor memory device and defect remedying method thereofHITACHI LTD·Filed 1999·Granted Dec 12, 2000·18 cites·45 claims
- 1953US5854508ASemiconductor memory device having zigzag bonding pad arrangementHITACHI LTD·Filed 1996·Granted Dec 29, 1998·15 cites·14 claims
- 2048USRE37539ESealed stacked arrangement of semiconductor devicesHITACHI LTD·Filed 1999·Granted Feb 5, 2002·12 cites·40 claims
- 2148US5268868AOutput buffer circuits for reducing ground bounce noiseHITACHI LTD·Filed 1991·Granted Dec 7, 1993·12 cites·15 claims
- 2247US4956811ASemiconductor memoryHITACHI LTD·Filed 1988·Granted Sep 11, 1990·10 cites·5 claims
- 2341US5018101ASemiconductor memoryHITACHI LTD·Filed 1990·Granted May 21, 1991·8 cites·6 claims
- 2432US5983358ASemiconductor memory having redundancy circuitHITACHI LTD·Filed 1997·Granted Nov 9, 1999·3 cites·15 claims
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