Inventor · disambiguated record
Jung Youn Pang
Also filed as: PANG JUNG YOUN
3 granted patents·4 pending applications·7 citations·filing 2012–2015
57Inventor score
Top patents by PatentIndex Score
7 records- 0183US9150002B2Electroless surface treatment plated layers of printed circuit board and method for preparing the sameLEE DONG JUN·Filed 2012·Granted Oct 6, 2015·7 cites·10 claims
- 0248US9743508B2Electroless surface treatment plated layers of printed circuit board and method for preparing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 22, 2017·0 cites·5 claims
- 0342US2015136466A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0441US2015027760A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECHANICS LTD·Filed 2013·Application pending·0 cites
- 0540US8946911B2Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Granted Feb 3, 2015·0 cites·12 claims
- 0640US2014069694A1Circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0738US2013000960A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
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