Inventor · disambiguated record
Bharat P. Penmecha
Also filed as: PENMECHA BHARAT · PENMECHA BHARAT P · PENMECHA BHARAT PRASAD
15 granted patents·5 pending applications·24 citations·filing 2015–2025
90Inventor score
Top patents by PatentIndex Score
20 records- 0197US11824018B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0297US11270942B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2020·Granted Mar 8, 2022·4 cites·17 claims
- 0396US12051647B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2023·Granted Jul 30, 2024·2 cites·17 claims
- 0496US11705398B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2022·Granted Jul 18, 2023·3 cites·17 claims
- 0592US12392970B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 19, 2025·2 cites·20 claims
- 0688US11901248B2Embedded die architecture and method of makingINTEL CORP·Filed 2020·Granted Feb 13, 2024·2 cites·20 claims
- 0787US12388019B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0886US12347782B2Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·16 claims
- 0985US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 1085US12199048B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1184US12272656B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1284US11735533B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2019·Granted Aug 22, 2023·2 cites·22 claims
- 1383US10643945B2Pitch translation architecture for semiconductor package including embedded interconnect bridgeINTEL CORP·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 1481US2025201734A1Heterogeneous nested interposer package for ic chipsINTEL CORP·Filed 2025·Application pending·0 cites
- 1574US2025293170A1Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2025·Application pending·0 cites
- 1672US9721906B2Electronic package with corner supportsINTEL CORP·Filed 2015·Granted Aug 1, 2017·2 cites·12 claims
- 1772US2024128138A1Embedded die architecture and method of makingINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2023089093A1In-built magnetic inductor schemes for glass core substratesINTEL CORP·Filed 2021·Application pending·0 cites
- 1949US12327797B2Microelectronic structures including glass coresINTEL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·6 claims
- 2035US2019393112A1Encapsulant material containing fluorophores for in-situ visualization of stress in an organic packageNOFEN ELIZABETH·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →