Inventor · disambiguated record
Tetsurou Ogushi
Also filed as: OGUSHI TETSUROU
9 granted patents·2 pending applications·455 citations·filing 1985–2003
91Inventor score
Files withMITSUBISHI ELECTRIC CORP10
Top patents by PatentIndex Score
11 records- 0196US6330907B1Evaporator and loop-type heat pipe using the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Dec 18, 2001·172 cites·10 claims
- 0293US6450132B1Loop type heat pipeMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 17, 2002·63 cites·20 claims
- 0392US6570086B1Cooling structure of communication deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted May 27, 2003·77 cites·7 claims
- 0480US5335720AHeat pipeMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 9, 1994·52 cites·8 claims
- 0570US4576009AHeat transmission deviceMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Mar 18, 1986·27 cites·15 claims
- 0664US5297623AHeat exchange apparatus and method for preparing the apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Mar 29, 1994·26 cites·4 claims
- 0753US5259447AHeat transport systemMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Nov 9, 1993·19 cites·27 claims
- 0843US5431216AHeat exchange apparatus and method for preparing the apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 11, 1995·13 cites·5 claims
- 0935US2003161132A1Communication deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 1034US6054025ASolid polyelectrolytic module and solid polyelectrolytic apparatus using sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Apr 25, 2000·6 cites·8 claims
- 1132US2002053420A1Cooling apparatus and cooling method for heating elementsFiled 2000·Application pending·0 cites
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