Inventor · disambiguated record
Uppili Sridhar
Also filed as: SRIDHAR UPPILI
37 granted patents·3 pending applications·1,051 citations·filing 1988–2021
98Inventor score
Files withINST OF MICROELECTRONICS16MAXIM INTEGRATED PRODUCTS7SRIDHAR UPPILI4HONEYWELL INC3TRIQUINT SEMICONDUCTOR INC2
Top patents by PatentIndex Score
40 records- 0197US6762049B2Miniaturized multi-chamber thermal cycler for independent thermal multiplexingINST OF MICROELECTRONICS·Filed 2001·Granted Jul 13, 2004·117 cites·15 claims
- 0296US7393758B2Wafer level packaging processMAXIM INTEGRATED PRODUCTS·Filed 2005·Granted Jul 1, 2008·49 cites·29 claims
- 0395US4952904AAdhesion layer for platinum based sensorsHONEYWELL INC·Filed 1988·Granted Aug 28, 1990·100 cites·22 claims
- 0493US7863699B2Bonded wafer package moduleTRIQUINT SEMICONDUCTOR INC·Filed 2008·Granted Jan 4, 2011·30 cites·38 claims
- 0593US6841839B2Microrelays and microrelay fabrication and operating methodsMAXIM INTEGRATED PRODUCTS·Filed 2003·Granted Jan 11, 2005·45 cites·3 claims
- 0690US6509186B1Miniaturized thermal cyclerINST OF MICROELECTRONICS·Filed 2001·Granted Jan 21, 2003·117 cites·8 claims
- 0788US5412994AOffset pressure sensorFiled 1994·Granted May 9, 1995·68 cites·18 claims
- 0887US6461888B1Lateral polysilicon beam processINST OF MICROELECTRONICS·Filed 2001·Granted Oct 8, 2002·70 cites·27 claims
- 0986US6432695B1Miniaturized thermal cyclerINST OF MICROELECTRONICS·Filed 2001·Granted Aug 13, 2002·60 cites·11 claims
- 1081US8940631B1Methods of forming coaxial feedthroughs for 3D integrated circuitsSRIDHAR UPPILI·Filed 2013·Granted Jan 27, 2015·5 cites·13 claims
- 1181US6621135B1Microrelays and microrelay fabrication and operating methodsMAXIM INTEGRATED PRODUCTS·Filed 2002·Granted Sep 16, 2003·20 cites·13 claims
- 1281US6503847B2Room temperature wafer-to-wafer bonding by polydimethylsiloxaneINST OF MICROELECTRONICS·Filed 2001·Granted Jan 7, 2003·26 cites·9 claims
- 1381US6495903B2Integrated circuit inductorINST OF MICROELECTRONICS·Filed 2000·Granted Dec 17, 2002·25 cites·9 claims
- 1480US9023422B1High rate deposition method of magnetic nanocompositesSRIDHAR UPPILI·Filed 2012·Granted May 5, 2015·2 cites·21 claims
- 1580US8686543B23D chip package with shielded structuresBERGEMONT ALBERT·Filed 2011·Granted Apr 1, 2014·7 cites·20 claims
- 1680US7463125B2Microrelays and microrelay fabrication and operating methodsMAXIM INTEGRATED PRODUCTS·Filed 2004·Granted Dec 9, 2008·22 cites·9 claims
- 1780US6573154B1High aspect ratio trench isolation process for surface micromachined sensors and actuatorsINST OF MICROELECTRONICS·Filed 2000·Granted Jun 3, 2003·35 cites·20 claims
- 1879US6662654B2Z-axis accelerometerINST OF MICROELECTRONICS·Filed 2003·Granted Dec 16, 2003·21 cites·10 claims
- 1978US6263740B1CMOS compatible integrated pressure sensorINST OF MICROELECTRONICS·Filed 2000·Granted Jul 24, 2001·26 cites·14 claims
- 2077US6521447B2Miniaturized thermal cyclerINST OF MICROELECTRONICS·Filed 2002·Granted Feb 18, 2003·26 cites·27 claims
- 2175US9184113B1Methods of forming coaxial feedthroughs for 3D integrated circuitsMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Nov 10, 2015·2 cites·12 claims
- 2274US6571628B1Z-axis accelerometerINST OF MICROELECTRONICS·Filed 2000·Granted Jun 3, 2003·17 cites·10 claims
- 2372US9331048B2Bonded stacked wafers and methods of electroplating bonded stacked wafersMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted May 3, 2016·1 cites·20 claims
- 2472US8512800B2Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filtersGODSHALK EDWARD MARTIN·Filed 2007·Granted Aug 20, 2013·9 cites·9 claims
- 2570US6293148B1Structural design for improving the sensitivity of a surface-micromachined vibratory gyroscopeINST OF MICROELECTRONICS·Filed 1999·Granted Sep 25, 2001·35 cites·3 claims
- 2668US5930595AIsolation process for surface micromachined sensors and actuatorsINST OF MICROELECTRONICS·Filed 1997·Granted Jul 27, 1999·37 cites·10 claims
- 2761US6908825B2Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loopINST OF MICROELECTRONICS·Filed 2002·Granted Jun 21, 2005·8 cites·7 claims
- 2861US6122975ACMOS compatible integrated pressure sensorINSTITUE OF MICROELECTRONICS·Filed 1998·Granted Sep 26, 2000·22 cites·14 claims
- 2958US8970043B2Bonded stacked wafers and methods of electroplating bonded stacked wafersZOU QUANBO·Filed 2011·Granted Mar 3, 2015·0 cites·16 claims
- 3058US6483223B2Method to prevent charging effects in electrostatic devicesINST OF MICROELECTRONICS·Filed 2001·Granted Nov 19, 2002·11 cites·25 claims
- 3154US5119166AHall effect element aligned to reduce package-induced offsetsHONEYWELL INC·Filed 1990·Granted Jun 2, 1992·12 cites·9 claims
- 3251US6858459B2Method of fabricating micro-mirror switching deviceINST OF MICROELECTRONICS·Filed 2002·Granted Feb 22, 2005·3 cites·27 claims
- 3347US8952768B2Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filtersTRIQUINT SEMICONDUCTOR INC·Filed 2013·Granted Feb 10, 2015·0 cites·6 claims
- 3446US10475559B1Controlling the morphology in metal loaded paste materialMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Nov 12, 2019·0 cites·9 claims
- 3542US2014347157A1Magnetic device utilizing nanocomposite films layered with adhesivesGEORGIA TECH RES INST·Filed 2012·Application pending·0 cites
- 3641US5360521AMethod for etching siliconHONEYWELL INC·Filed 1993·Granted Nov 1, 1994·12 cites·18 claims
- 3740US6765300B1Micro-relayTYCO ELECTRONICS LOGISTICS AG·Filed 1999·Granted Jul 20, 2004·10 cites·45 claims
- 3839USD1040992SStove exhaust systemUPPILI SUDARSAN·Filed 2021·Granted Sep 3, 2024·1 cites·1 claims
- 3937US2012194306A1Preventing contact stiction in micro relaysSRIDHAR UPPILI·Filed 2011·Application pending·0 cites
- 4034US2007035364A1Titanium-tungsten alloy based mirrors and electrodes in bulk acoustic wave devicesSRIDHAR UPPILI·Filed 2005·Application pending·0 cites
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