Inventor · disambiguated record
Pang Dow Foo
Also filed as: FOO PANG D · FOO PANG DOW
20 granted patents·3 pending applications·729 citations·filing 1988–2005
96Inventor score
Files withINST OF MICROELECTRONICS11AT & T BELL LAB3LUCENT TECHNOLOGIES INC2AMERICAN TELEPHONE & TELEGRAPH1INST MICROELECTRONICS1
Top patents by PatentIndex Score
23 records- 0194US5616518AProcess for fabricating integrating circuitsLUCENT TECHNOLOGIES INC·Filed 1994·Granted Apr 1, 1997·188 cites·9 claims
- 0291US6461902B1RF LDMOS on partial SOI substrateINST OF MICROELECTRONICS·Filed 2000·Granted Oct 8, 2002·57 cites·7 claims
- 0388US6436810B1Bi-layer resist process for dual damasceneINST OF MICROELECTRONICS·Filed 2000·Granted Aug 20, 2002·50 cites·20 claims
- 0485US5124014AMethod of forming oxide layers by bias ECR plasma depositionAT & T BELL LAB·Filed 1991·Granted Jun 23, 1992·122 cites·7 claims
- 0581US6503847B2Room temperature wafer-to-wafer bonding by polydimethylsiloxaneINST OF MICROELECTRONICS·Filed 2001·Granted Jan 7, 2003·26 cites·9 claims
- 0681US6495903B2Integrated circuit inductorINST OF MICROELECTRONICS·Filed 2000·Granted Dec 17, 2002·25 cites·9 claims
- 0781US5643838ALow temperature deposition of silicon oxides for device fabricationLUCENT TECHNOLOGIES INC·Filed 1993·Granted Jul 1, 1997·76 cites·11 claims
- 0873US5120680AMethod for depositing dielectric layersAT & T BELL LAB·Filed 1990·Granted Jun 9, 1992·57 cites·3 claims
- 0967US6489203B2Stacked LDD high frequency LDMOSFETINST OF MICROELECTRONICS·Filed 2001·Granted Dec 3, 2002·12 cites·8 claims
- 1061US6908825B2Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loopINST OF MICROELECTRONICS·Filed 2002·Granted Jun 21, 2005·8 cites·7 claims
- 1161US6122975ACMOS compatible integrated pressure sensorINSTITUE OF MICROELECTRONICS·Filed 1998·Granted Sep 26, 2000·22 cites·14 claims
- 1258US6007728ADesign of a novel tactile sensorINST OF MICOELECTRONICS·Filed 1997·Granted Dec 28, 1999·25 cites·30 claims
- 1355US6664596B2Stacked LDD high frequency LDMOSFETINST OF MICROELECTRONICS·Filed 2002·Granted Dec 16, 2003·5 cites·13 claims
- 1453US6855640B2Apparatus and process for bulk wet etch with leakage protectionINST OF MICROELECTRONICS·Filed 2002·Granted Feb 15, 2005·3 cites·11 claims
- 1552US5057455AFormation of integrated circuit electrodesAT & T BELL LAB·Filed 1989·Granted Oct 15, 1991·18 cites·16 claims
- 1650US6670272B2Method for reducing dishing in chemical mechanical polishingINST MICROELECTRONICS·Filed 2001·Granted Dec 30, 2003·8 cites·11 claims
- 1746US6667516B2RF LDMOS on partial SOI substrateINST OF MICROELECTRONICS·Filed 2002·Granted Dec 23, 2003·2 cites·12 claims
- 1846US2005118822A1Apparatus and process for bulk wet etch with leakage protectionINST OF MICROELECTRONICS·Filed 2005·Application pending·0 cites
- 1943US6383855B1High speed, low cost BICMOS process using profile engineeringINST OF MICROELECTRONICS·Filed 1998·Granted May 7, 2002·9 cites·24 claims
- 2040US6765300B1Micro-relayTYCO ELECTRONICS LOGISTICS AG·Filed 1999·Granted Jul 20, 2004·10 cites·45 claims
- 2134US2002017682A1Semiconductor deviceFiled 2000·Application pending·0 cites
- 2233US4871420ASelective etching processAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Oct 3, 1989·6 cites·7 claims
- 2327US2003040174A1Method for preventing photoresist poisoning in semiconductor fabricationFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →