Inventor · disambiguated record
Taishi Wakabayashi
Also filed as: WAKABAYASHI TAISHI
5 granted patents·1 pending application·6 citations·filing 2015–2020
67Inventor score
Files withSHINETSU HANDOTAI KK6
Top patents by PatentIndex Score
6 records- 0173US10763127B2Heat treatment method for semiconductor waferSHINETSU HANDOTAI KK·Filed 2017·Granted Sep 1, 2020·3 cites·4 claims
- 0271US10460983B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2015·Granted Oct 29, 2019·2 cites·1 claims
- 0360US10529615B2Method for manufacturing a bonded SOI wafer and bonded SOI waferSHINETSU HANDOTAI KK·Filed 2015·Granted Jan 7, 2020·1 cites·3 claims
- 0444US11495488B2Method for manufacturing bonded SOI wafer and bonded SOI waferSHINETSU HANDOTAI KK·Filed 2019·Granted Nov 8, 2022·0 cites·6 claims
- 0542US2023154748A1Method for manufacturing semiconductor substrate and semiconductor substrateSHINETSU HANDOTAI KK·Filed 2020·Application pending·0 cites
- 0634US10566196B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Feb 18, 2020·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →