Inventor · disambiguated record
Miho Niitani
Also filed as: NIITANI Miho
2 granted patents·1 pending application·3 citations·filing 2017–2020
37Inventor score
Technology areasH10P
Files withSHINETSU HANDOTAI KK3
Top patents by PatentIndex Score
3 records- 0173US10763127B2Heat treatment method for semiconductor waferSHINETSU HANDOTAI KK·Filed 2017·Granted Sep 1, 2020·3 cites·4 claims
- 0244US11495488B2Method for manufacturing bonded SOI wafer and bonded SOI waferSHINETSU HANDOTAI KK·Filed 2019·Granted Nov 8, 2022·0 cites·6 claims
- 0342US2023154748A1Method for manufacturing semiconductor substrate and semiconductor substrateSHINETSU HANDOTAI KK·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →