Inventor · disambiguated record
Zengbiao Huang
Also filed as: HUANG ZENGBIAO
7 granted patents·1 pending application·4 citations·filing 2015–2023
71Inventor score
Files withSHENGYI TECHNOLOGY CO LTD8
Top patents by PatentIndex Score
8 records- 0183US10240074B2Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods thereforSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Mar 26, 2019·3 cites·20 claims
- 0277US11661378B2Boron nitride agglomerate, thermosetting resin composition containing same, and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2018·Granted May 30, 2023·1 cites·19 claims
- 0369US2024425730A1Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 0464US12378386B2Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·16 claims
- 0561US11732123B2Thermosetting resin composition, and prepreg, laminate and printed circuit board using sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Aug 22, 2023·0 cites·19 claims
- 0654US12122904B2Thermosetting resin composition and prepreg, laminate and printed circuit board using sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·19 claims
- 0751US11649351B2Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted May 16, 2023·0 cites·9 claims
- 0837US10400058B2Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereofSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Sep 3, 2019·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →