Inventor · disambiguated record
Pradip K. Roy
Also filed as: ROY PRADIP · ROY PRADIP K · ROY PRADIP KUMAR
139 granted patents·18 pending applications·5,115 citations·filing 1977–2016
99Inventor score
Files withAGERE SYST GUARDIAN CORP41LUCENT TECHNOLOGIES INC37AGERE SYSTEMS INC26AT & T BELL LAB7NEXPLANAR CORP6
Top patents by PatentIndex Score
157 records- 0198US8380339B2Customized polish pads for chemical mechanical planarizationNEXPLANAR CORP·Filed 2010·Granted Feb 19, 2013·27 cites·15 claims
- 0298US7704125B2Customized polishing pads for CMP and methods of fabrication and use thereofNEXPLANAR CORP·Filed 2005·Granted Apr 27, 2010·60 cites·32 claims
- 0397US10220487B2Customized polishing pads for CMP and methods of fabrication and use thereofNEXPLANAR CORP·Filed 2016·Granted Mar 5, 2019·15 cites·3 claims
- 0497US9278424B2Customized polishing pads for CMP and methods of fabrication and use thereofNEXPLANAR CORP·Filed 2014·Granted Mar 8, 2016·32 cites·21 claims
- 0597US7704122B2Customized polish pads for chemical mechanical planarizationNEXPLANAR CORP·Filed 2007·Granted Apr 27, 2010·29 cites·29 claims
- 0697US6246095B1System and method for forming a uniform thin gate oxide layerAGERE SYST GUARDIAN CORP·Filed 1998·Granted Jun 12, 2001·250 cites·13 claims
- 0797US6025280AUse of SiD4 for deposition of ultra thin and controllable oxidesLUCENT TECHNOLOGIES INC·Filed 1997·Granted Feb 15, 2000·282 cites·14 claims
- 0897US5940736AMethod for forming a high quality ultrathin gate oxide layerLUCENT TECHNOLOGIES INC·Filed 1997·Granted Aug 17, 1999·264 cites·13 claims
- 0995US8932116B2Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designsDEOPURA MANISH·Filed 2012·Granted Jan 13, 2015·28 cites·5 claims
- 1095US8715035B2Customized polishing pads for CMP and methods of fabrication and use thereofROY PRADIP K·Filed 2006·Granted May 6, 2014·42 cites·48 claims
- 1195US8287793B2Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designsDEOPURA MANISH·Filed 2007·Granted Oct 16, 2012·36 cites·11 claims
- 1295US7831123B2Microphotonic waveguide including core/cladding interface layerMASSACHUSETTS INST TECHNOLOGY·Filed 2007·Granted Nov 9, 2010·45 cites·18 claims
- 1395US4851370AFabricating a semiconductor device with low defect density oxideAMERICAN TELEPHONE & TELEGRAPH·Filed 1987·Granted Jul 25, 1989·319 cites·9 claims
- 1494US6011404ASystem and method for determining near--surface lifetimes and the tunneling field of a dielectric in a semiconductorLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jan 4, 2000·166 cites·30 claims
- 1594US4289794AProcess of preparing gasified candyGEN FOODS CORP·Filed 1980·Granted Sep 15, 1981·128 cites·8 claims
- 1693US7425172B2Customized polish pads for chemical mechanical planarizationNEXPLANAR CORP·Filed 2004·Granted Sep 16, 2008·36 cites·24 claims
- 1793US6535014B2Electrical parameter tester having decoupling meansLUCENT TECHNOLOGIES INC·Filed 2001·Granted Mar 18, 2003·59 cites·17 claims
- 1893US6320244B1Integrated circuit device having dual damascene capacitorAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 20, 2001·152 cites·21 claims
- 1993US5573965AMethod of fabricating semiconductor devices and integrated circuits using sidewall spacer technologyLUCENT TECHNOLOGIES INC·Filed 1993·Granted Nov 12, 1996·114 cites·17 claims
- 2092US6368200B1Polishing pads from closed-cell elastomer foamAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 9, 2002·43 cites·7 claims
- 2191US8864859B2Customized polishing pads for CMP and methods of fabrication and use thereofROY PRADIP K·Filed 2007·Granted Oct 21, 2014·29 cites·25 claims
- 2291US6320238B1Gate structure for integrated circuit fabricationAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 20, 2001·89 cites·16 claims
- 2390US7605064B2Selective laser annealing of semiconductor materialAGERE SYSTEMS INC·Filed 2006·Granted Oct 20, 2009·15 cites·16 claims
- 2490US6364744B1CMP system and slurry for polishing semiconductor wafers and related methodAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 2, 2002·50 cites·32 claims
- 2590US6180518B1Method for forming vias in a low dielectric constant materialLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 30, 2001·100 cites·32 claims
- 2689US7377840B2Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designsNEOPAD TECHNOLOGIES CORP·Filed 2004·Granted May 27, 2008·47 cites·7 claims
- 2789US6071808AMethod of passivating copper interconnects in a semiconductorLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jun 6, 2000·99 cites·20 claims
- 2889US4273793AApparatus and process for the preparation of gasified confectionaries by pressurized injection moldingGEN FOODS CORP·Filed 1979·Granted Jun 16, 1981·74 cites·21 claims
- 2987US6100587ASilicon carbide barrier layers for porous low dielectric constant materialsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Aug 8, 2000·72 cites·6 claims
- 3086US6659846B2Pad for chemical mechanical polishingAGERE SYSTEMS INC·Filed 2001·Granted Dec 9, 2003·28 cites·20 claims
- 3186US6265260B1Method for making an integrated circuit capacitor including tantalum pentoxideLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jul 24, 2001·78 cites·27 claims
- 3286US5147820ASilicide formation on polysiliconAT & T BELL LAB·Filed 1991·Granted Sep 15, 1992·68 cites·15 claims
- 3385US5489552AMultiple layer tungsten deposition processAT & T CORP·Filed 1994·Granted Feb 6, 1996·78 cites·18 claims
- 3484US6461225B1Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP)AGERE SYST GUARDIAN CORP·Filed 2000·Granted Oct 8, 2002·39 cites·22 claims
- 3584US6340827B1Diffusion barrier for use with high dielectric constant materials and electronic devices incorporating sameAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jan 22, 2002·30 cites·51 claims
- 3684US6140187AProcess for forming metal oxide semiconductors including an in situ furnace gate stack with varying silicon nitride deposition rateLUCENT TECHNOLOGIES INC·Filed 1998·Granted Oct 31, 2000·68 cites·15 claims
- 3784US4271206AGasified candy having a predetermined shapeGEN FOODS CORP·Filed 1979·Granted Jun 2, 1981·55 cites·11 claims
- 3883US6664800B2Non-contact method for determining quality of semiconductor dielectricsAGERE SYSTEMS INC·Filed 2001·Granted Dec 16, 2003·28 cites·12 claims
- 3983US6410419B1Silicon carbide barrier layers for porous low dielectric constant materialsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jun 25, 2002·29 cites·12 claims
- 4083US5298436AForming a device dielectric on a deposited semiconductor having sub-layersAT & T BELL LAB·Filed 1993·Granted Mar 29, 1994·54 cites·26 claims
- 4183US4742020AMultilayering process for stress accommodation in deposited polysiliconAMERICAN TELEPHONE & TELEGRAPH·Filed 1985·Granted May 3, 1988·63 cites·10 claims
- 4281US6387772B1Method for forming trench capacitors in SOI substratesAGERE SYST GUARDIAN CORP·Filed 2000·Granted May 14, 2002·25 cites·11 claims
- 4380US6551946B1Two-step oxidation process for oxidizing a silicon substrate wherein the first step is carried out at a temperature below the viscoelastic temperature of silicon dioxide and the second step is carried out at a temperature above the viscoelastic temperatureAGERE SYSTEMS INC·Filed 2000·Granted Apr 22, 2003·26 cites·10 claims
- 4480US6265890B1In-line non-contact depletion capacitance measurement method and apparatusLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jul 24, 2001·44 cites·8 claims
- 4580US6168991B1DRAM capacitor including Cu plug and Ta barrier and method of formingLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 2, 2001·57 cites·12 claims
- 4680US6008091AFloating gate avalanche injection MOS transistors with high K dielectric control gatesLUCENT TECHNOLOGIES INC·Filed 1998·Granted Dec 28, 1999·58 cites·9 claims
- 4780US5505978ABaked corn-based product and processAPV BAKER INC·Filed 1994·Granted Apr 9, 1996·42 cites·24 claims
- 4879USD526762SMulti-piece fruit snackKELLOG CO·Filed 2003·Granted Aug 22, 2006·24 cites·1 claims
- 4979US6403415B1Semiconductor device having a metal barrier layer for a dielectric material having a high dielectric constant and a method of manufacture thereofAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jun 11, 2002·23 cites·13 claims
- 5079US6391668B1Method of determining a trap density of a semiconductor/oxide interface by a contactless charge techniqueAGERE SYST GUARDIAN CORP·Filed 2000·Granted May 21, 2002·27 cites·33 claims
Showing the top 50 of 157 patent records by PatentIndex Score.
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