Inventor · disambiguated record
Sailesh Mansinh Merchant
Also filed as: MERCHANT SAILESH · MERCHANT SAILESH M · MERCHANT SAILESH MANSINH
135 granted patents·16 pending applications·3,003 citations·filing 1991–2015
99Inventor score
Files withAGERE SYSTEMS INC47AGERE SYST GUARDIAN CORP41LUCENT TECHNOLOGIES INC35LSI CORP5BACHMAN MARK A4
Top patents by PatentIndex Score
151 records- 0196US8492911B2Stacked interconnect heat sinkBACHMAN MARK A·Filed 2010·Granted Jul 23, 2013·34 cites·7 claims
- 0296US7068139B2Inductor formed in an integrated circuitAGERE SYSTEMS INC·Filed 2004·Granted Jun 27, 2006·66 cites·18 claims
- 0395US8987137B2Method of fabrication of through-substrate viasBACHMAN MARK A·Filed 2010·Granted Mar 24, 2015·25 cites·18 claims
- 0493US6720261B1Method and system for eliminating extrusions in semiconductor viasAGERE SYSTEMS INC·Filed 2000·Granted Apr 13, 2004·91 cites·16 claims
- 0593US6320244B1Integrated circuit device having dual damascene capacitorAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 20, 2001·152 cites·21 claims
- 0692US7952206B2Solder bump structure for flip chip semiconductor devices and method of manufacture thereforeAGERE SYSTEMS INC·Filed 2006·Granted May 31, 2011·20 cites·10 claims
- 0792US7301231B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2006·Granted Nov 27, 2007·31 cites·7 claims
- 0892US6790757B1Wire bonding method for copper interconnects in semiconductor devicesAGERE SYSTEMS INC·Filed 1999·Granted Sep 14, 2004·111 cites·16 claims
- 0992US6368200B1Polishing pads from closed-cell elastomer foamAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 9, 2002·43 cites·7 claims
- 1091US8742535B2Integration of shallow trench isolation and through-substrate vias into integrated circuit designsBACHMAN MARK A·Filed 2010·Granted Jun 3, 2014·13 cites·9 claims
- 1191US7429502B2Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2007·Granted Sep 30, 2008·23 cites·10 claims
- 1291US6320238B1Gate structure for integrated circuit fabricationAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 20, 2001·89 cites·16 claims
- 1390US7115985B2Reinforced bond pad for a semiconductor deviceAGERE SYSTEMS INC·Filed 2004·Granted Oct 3, 2006·65 cites·10 claims
- 1490US6364744B1CMP system and slurry for polishing semiconductor wafers and related methodAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 2, 2002·50 cites·32 claims
- 1590US6294468B1Method of chemical vapor depositing tungsten filmsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Sep 25, 2001·72 cites·28 claims
- 1690US6180518B1Method for forming vias in a low dielectric constant materialLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 30, 2001·100 cites·32 claims
- 1790US5972179ASilicon IC contacts using composite TiN barrier layerLUCENT TECHNOLOGIES INC·Filed 1997·Granted Oct 26, 1999·114 cites·11 claims
- 1889US6071808AMethod of passivating copper interconnects in a semiconductorLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jun 6, 2000·99 cites·20 claims
- 1987US6100587ASilicon carbide barrier layers for porous low dielectric constant materialsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Aug 8, 2000·72 cites·6 claims
- 2085US5489552AMultiple layer tungsten deposition processAT & T CORP·Filed 1994·Granted Feb 6, 1996·78 cites·18 claims
- 2184US7301107B2Semiconductor device having reduced intra-level and inter-level capacitanceAGERE SYSTEMS INC·Filed 2003·Granted Nov 27, 2007·37 cites·8 claims
- 2284US6340827B1Diffusion barrier for use with high dielectric constant materials and electronic devices incorporating sameAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jan 22, 2002·30 cites·51 claims
- 2383US6686662B2Semiconductor device barrier layerAGERE SYSTEMS INC·Filed 2002·Granted Feb 3, 2004·37 cites·19 claims
- 2483US6472304B2Wire bonding to copperAGERE SYSTEMS INC·Filed 2001·Granted Oct 29, 2002·35 cites·3 claims
- 2583US6410419B1Silicon carbide barrier layers for porous low dielectric constant materialsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jun 25, 2002·29 cites·12 claims
- 2682US8507317B2Solder bump structure for flip chip semiconductor devices and method of manufacturing thereforeBACHMAN MARK A·Filed 2011·Granted Aug 13, 2013·5 cites·7 claims
- 2782US8319343B2Routing under bond pad for the replacement of an interconnect layerARCHER III VANCE D·Filed 2006·Granted Nov 27, 2012·13 cites·10 claims
- 2881US7397103B2Semiconductor with damage detection circuitryAGERE SYSTEMS INC·Filed 2005·Granted Jul 8, 2008·11 cites·13 claims
- 2980US6168991B1DRAM capacitor including Cu plug and Ta barrier and method of formingLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 2, 2001·57 cites·12 claims
- 3079US7777333B2Structure and method for fabricating flip chip devicesAGERE SYSTEMS INC·Filed 2006·Granted Aug 17, 2010·9 cites·17 claims
- 3179US6532489B1Electronic mail alerting system and method with user optionsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Mar 11, 2003·101 cites·15 claims
- 3279US6403415B1Semiconductor device having a metal barrier layer for a dielectric material having a high dielectric constant and a method of manufacture thereofAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jun 11, 2002·23 cites·13 claims
- 3378US5858873AIntegrated circuit having amorphous silicide layer in contacts and vias and method of manufacture thereofLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jan 12, 1999·45 cites·7 claims
- 3477US6869873B2Copper silicide passivation for improved reliabilityAGERE SYSTEMS INC·Filed 2003·Granted Mar 22, 2005·26 cites·9 claims
- 3577US6784478B2Junction capacitor structure and fabrication method therefor in a dual damascene processAGERE SYSTEMS INC·Filed 2002·Granted Aug 31, 2004·25 cites·10 claims
- 3676US7948914B2Power learning security in wireless routersAGERE SYSTEMS INC·Filed 2009·Granted May 24, 2011·6 cites·13 claims
- 3776US7328830B2Structure and method for bonding to copper interconnect structuresAGERE SYSTEMS INC·Filed 2003·Granted Feb 12, 2008·22 cites·16 claims
- 3876US6373087B1Methods of fabricating a metal-oxide-metal capacitor and associated apparatusesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 16, 2002·16 cites·6 claims
- 3976US6365511B1Tungsten silicide nitride as a barrier for high temperature anneals to improve hot carrier reliabilityAGERE SYST GUARDIAN CORP·Filed 1999·Granted Apr 2, 2002·47 cites·13 claims
- 4076US5523259AMethod of forming metal layers formed as a composite of sub-layers using Ti texture control layerAT & T CORP·Filed 1994·Granted Jun 4, 1996·52 cites·24 claims
- 4175US9613847B2Integration of shallow trench isolation and through-substrate vias into integrated circuit designsLSI CORP·Filed 2014·Granted Apr 4, 2017·3 cites·15 claims
- 4275US7388395B2Test semiconductor device and method for determining Joule heating effects in such a deviceAGERE SYSTEMS INC·Filed 2006·Granted Jun 17, 2008·4 cites·6 claims
- 4375US6498364B1Capacitor for integration with copper damascene processesAGERE SYSTEMS INC·Filed 2000·Granted Dec 24, 2002·21 cites·10 claims
- 4474US6599837B1Chemical mechanical polishing composition and method of polishing metal layers using sameAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jul 29, 2003·16 cites·10 claims
- 4574US6235594B1Methods of fabricating an integrated circuit device with composite oxide dielectricAGERE SYST GUARDIAN CORP·Filed 1999·Granted May 22, 2001·33 cites·31 claims
- 4673US6331484B1Titanium-tantalum barrier layer film and method for forming the sameLUCENT TECHNOLOGIES INC·Filed 2000·Granted Dec 18, 2001·20 cites·41 claims
- 4772US6541394B1Method of making a graded grown, high quality oxide layer for a semiconductor deviceAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 1, 2003·15 cites·33 claims
- 4872US6410986B1Multi-layered titanium nitride barrier structureAGERE SYST GUARDIAN CORP·Filed 1998·Granted Jun 25, 2002·40 cites·6 claims
- 4972US6319095B1Colloidal suspension of abrasive particles containing magnesium as CMP slurryAGERE SYST GUARDIAN CORP·Filed 2000·Granted Nov 20, 2001·14 cites·15 claims
- 5072US6281129B1Corrosion-resistant polishing pad conditionerAGERE SYST GUARDIAN CORP·Filed 1999·Granted Aug 28, 2001·31 cites·9 claims
Showing the top 50 of 151 patent records by PatentIndex Score.
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