Inventor · disambiguated record
Freek Egbert Van Straten
Also filed as: VAN STRATEN FREEK · VAN STRATEN FREEK EGBERT
13 granted patents·2 pending applications·31 citations·filing 2003–2023
86Inventor score
Files withNXP USA INC8NXP BV3AMPLEON NETHERLANDS BV2DE GRAAUW ANTONIUS JOHANNES MATHEUS1JEDEMA FRISO JACOBUS1
Top patents by PatentIndex Score
15 records- 0186US9184469B2BatteryJEDEMA FRISO JACOBUS·Filed 2011·Granted Nov 10, 2015·7 cites·18 claims
- 0284US8854277B2Millimetre-wave radio antenna moduleDE GRAAUW ANTONIUS JOHANNES MATHEUS·Filed 2009·Granted Oct 7, 2014·18 cites·19 claims
- 0383US11621228B2Substrate with thermal vias and sinter-bonded thermal dissipation structureNXP USA INC·Filed 2020·Granted Apr 4, 2023·1 cites·11 claims
- 0481US11842957B2Amplifier modules and systems with ground terminals adjacent to power amplifier dieNXP USA INC·Filed 2020·Granted Dec 12, 2023·1 cites·19 claims
- 0576US12506084B2Methods of fabricating substrates with thermal vias and sinter-bonded thermal dissipation structuresNXP USA INC·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0657US12482719B2Low-stress thermal interfaceNXP USA INC·Filed 2022·Granted Nov 25, 2025·0 cites·26 claims
- 0757US11929310B2Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methodsNXP USA INC·Filed 2021·Granted Mar 12, 2024·0 cites·19 claims
- 0857US2025167185A1Stacked electronic packagesNXP USA INC·Filed 2023·Application pending·0 cites
- 0957US2025167083A1Panel level fabrication of stacked electronic device packages with enclosed cavitiesNXP USA INC·Filed 2023·Application pending·0 cites
- 1053US12014971B2Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereofNXP USA INC·Filed 2021·Granted Jun 18, 2024·0 cites·22 claims
- 1148US9214908B2Amplification circuitNXP BV·Filed 2014·Granted Dec 15, 2015·1 cites·16 claims
- 1247US9570323B2Semiconductor device leadframeAMPLEON NETHERLANDS BV·Filed 2014·Granted Feb 14, 2017·0 cites·19 claims
- 1344US7394994B2Optical receiver circuitNXP BV·Filed 2003·Granted Jul 1, 2008·3 cites·16 claims
- 1443US9911628B2Semiconductor device leadframeAMPLEON NETHERLANDS BV·Filed 2016·Granted Mar 6, 2018·0 cites·12 claims
- 1542US9190350B2Semiconductor device leadframeNXP BV·Filed 2014·Granted Nov 17, 2015·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →