Inventor · disambiguated record
William H. Holtkamp
Also filed as: HOLTKAMP WILLIAM · HOLTKAMP WILLIAM H
11 granted patents·958 citations·filing 1994–2006
94Inventor score
Top patents by PatentIndex Score
11 records- 0197US6077412ARotating anode for a wafer processing chamberCUTEK RESEARCH INC·Filed 1998·Granted Jun 20, 2000·192 cites·22 claims
- 0296US6017820AIntegrated vacuum and plating cluster systemCUTEK RESEARCH INC·Filed 1998·Granted Jan 25, 2000·282 cites·18 claims
- 0396US6017437AProcess chamber and method for depositing and/or removing material on a substrateCUTEK RESEARCH INC·Filed 1997·Granted Jan 25, 2000·178 cites·30 claims
- 0491US8398355B2Linearly distributed semiconductor workpiece processing toolHOLTKAMP WILLIAM·Filed 2006·Granted Mar 19, 2013·32 cites·24 claims
- 0588US6179982B1Introducing and reclaiming liquid in a wafer processing chamberCUTEK RES INC·Filed 1998·Granted Jan 30, 2001·62 cites·19 claims
- 0688US5660397ADevices employing a liquid-free mediumFiled 1994·Granted Aug 26, 1997·56 cites·40 claims
- 0785US6187152B1Multiple station processing chamber and method for depositing and/or removing material on a substrateCUTEK RES INC·Filed 1998·Granted Feb 13, 2001·67 cites·22 claims
- 0884US5704613AMethods for sealing and unsealing using a magnetically permeable solid-based mediumFiled 1996·Granted Jan 6, 1998·42 cites·22 claims
- 0979US6365025B1Method for depositing and/or removing material on a substrateCUTEK RES INC·Filed 2000·Granted Apr 2, 2002·20 cites·9 claims
- 1059US6022465AApparatus and method utilizing an electrode adapter for customized contact placement on a waferCUTEK RESEARCH INC·Filed 1998·Granted Feb 8, 2000·23 cites·27 claims
- 1134US6183611B1Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrateCUTEK RES INC·Filed 1998·Granted Feb 6, 2001·4 cites·16 claims
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