Inventor · disambiguated record

Seok Hwi Cheon

Also filed as: CHEON SEOK HWI

1 granted patent·0 citations·filing 2018–2018

5Inventor score

Technology areasH10W

Files withNEPES CO LTD1

Top patents by PatentIndex Score

1 record

0137US11264330B2Chip package with connection portion that passes through an encapsulation portionNEPES CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·16 claims

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