Inventor · disambiguated record
Jochen Dangelmaier
Also filed as: DANGELMAIER JOCHEN
48 granted patents·8 pending applications·327 citations·filing 2003–2024
97Inventor score
Files withINFINEON TECHNOLOGIES AG50THEUSS HORST2AVAGO TECH FIBER IP SG PTE LTD1DANGELMAIER JOCHEN1EWE HENRIK1
Top patents by PatentIndex Score
56 records- 0197US11835600B2Current sensorINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 5, 2023·3 cites·20 claims
- 0297US7385394B2Integrated magnetic sensor componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 10, 2008·108 cites·21 claims
- 0392US9013013B1Pressure sensor package having a stacked die arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 21, 2015·16 cites·22 claims
- 0491US7221048B2Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrierINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·26 cites·16 claims
- 0590US7732915B2Semiconductor sensor device with sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 8, 2010·17 cites·16 claims
- 0689US7786577B2Component with chip through-contactsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 31, 2010·18 cites·14 claims
- 0789US7413353B2Device and method for data transmission between structural units connected by an articulated jointINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 19, 2008·24 cites·31 claims
- 0888US10107867B2Sensor arrangement, battery cell and energy systemINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 23, 2018·3 cites·18 claims
- 0987US9748611B2Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 29, 2017·4 cites·5 claims
- 1086US10818805B2Semiconductor sensor device and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 27, 2020·2 cites·20 claims
- 1183US2025117099A1Ultrasonic touch sensorINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1281US12366615B2Current sensor that includes a current rail and a magnetic field sensor with galvanic isolationINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 1380US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1480US7505276B2Semiconductor module provided with contacts extending through the packageINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 17, 2009·9 cites·18 claims
- 1579US7417198B2Radiofrequency power semiconductor module with cavity housing, and method for producing itINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 26, 2008·29 cites·28 claims
- 1678US12399153B2Photoacoustic sensors and MEMS devicesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1778US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 1876US12210706B2Ultrasonic touch sensorINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 28, 2025·0 cites·26 claims
- 1976US9704786B2Direct selective adhesion promotor platingINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·3 cites·17 claims
- 2072US8767983B2Module including a micro-electro-mechanical microphoneTHEUSS HORST·Filed 2007·Granted Jul 1, 2014·5 cites·39 claims
- 2172US7659618B2Semiconductor device for radio frequencies of more than 10 GHz and method for producing the deviceINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 9, 2010·5 cites·17 claims
- 2270US11573204B2Photoacoustic sensors and MEMS devicesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 2370US7719101B2Semiconductor device with surface-mountable external contacts and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 18, 2010·4 cites·13 claims
- 2470US7268423B2Flexible rewiring plate for semiconductor components, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·12 cites·17 claims
- 2568US12033972B2Chip package, method of forming a chip package and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 2664US11851322B2Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chipsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 26, 2023·0 cites·22 claims
- 2763US7964448B2Electronic device and method of manufacturing sameINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 21, 2011·2 cites·17 claims
- 2862US9658296B2Current sensor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 23, 2017·1 cites·24 claims
- 2962US2025011164A1Sensor deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3060US8482135B2Method for producing a component and device having a componentTHEUSS HORST·Filed 2007·Granted Jul 9, 2013·2 cites·23 claims
- 3160US7766560B2Connector module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 3, 2010·2 cites·44 claims
- 3260US7476036B2Optocoupler for converting optical signals into electrical signals and vice versaINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 13, 2009·2 cites·18 claims
- 3360US7037844B2Method for manufacturing a housing for a chip having a micromechanical structureINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 2, 2006·16 cites·13 claims
- 3459US11239176B2Package comprising identifier on and/or in carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 1, 2022·0 cites·21 claims
- 3558US7597484B2MID module and a method of mounting an optical fibre in an MID moduleAVAGO TECH FIBER IP SG PTE LTD·Filed 2007·Granted Oct 6, 2009·2 cites·11 claims
- 3657US9986354B2Pre-mold for a microphone assembly and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 29, 2018·1 cites·10 claims
- 3755US7911041B2Semiconductor device with gold coatings, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 22, 2011·1 cites·26 claims
- 3855US7635911B2Chip carrier and system including a chip carrier and semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 22, 2009·1 cites·24 claims
- 3954US11024565B2Direct selective adhesion promotor platingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4054US2023292626A1Magnetic field sensor with mechanically protected permanent magnetINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 4153US11410942B2Package with selective corrosion protection of electric connection structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 4252US8872314B2Method for producing a component and device comprising a componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 28, 2014·0 cites·16 claims
- 4352US7071571B2Semiconductor component having a plastic housing and methods for its productionINFINEON TECHNOLOIGES AG·Filed 2004·Granted Jul 4, 2006·5 cites·11 claims
- 4451US2015132614A1Sensor arrangement, energy system and methodINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 4550US9059083B2Semiconductor deviceEWE HENRIK·Filed 2007·Granted Jun 16, 2015·0 cites·10 claims
- 4649US10297536B2Direct selective adhesion promotor platingINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 21, 2019·0 cites·16 claims
- 4749US7504711B2Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 17, 2009·0 cites·16 claims
- 4847US10781095B2Molded lead frame sensor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 4945US11073572B2Current sensor device with a routable molded lead frameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 5045US2015279782A1Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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