Inventor · disambiguated record
George F. Walker
Also filed as: MCKNIGHT SAMUEL R · WALKER GEORGE · WALKER GEORGE F · WALKER GEORGE FREDERICK
86 granted patents·55 pending applications·7,243 citations·filing 1975–2016
99Inventor score
Top patents by PatentIndex Score
141 records- 0199US6334247B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1997·Granted Jan 1, 2002·277 cites·80 claims
- 0299US5821763ATest probe for high density integrated circuits, methods of fabrication thereof and methods of use thereofIBM·Filed 1996·Granted Oct 13, 1998·349 cites·13 claims
- 0399US5682143ARadio frequency identification tagIBM·Filed 1994·Granted Oct 28, 1997·557 cites·20 claims
- 0499US5635846ATest probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformerIBM·Filed 1993·Granted Jun 3, 1997·342 cites·7 claims
- 0599US5371654AThree dimensional high performance interconnection packageIBM·Filed 1992·Granted Dec 6, 1994·503 cites·25 claims
- 0698US6300780B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1998·Granted Oct 9, 2001·197 cites·17 claims
- 0798US5600257ASemiconductor wafer test and burn-inIBM·Filed 1995·Granted Feb 4, 1997·196 cites·4 claims
- 0898US5531022AMethod of forming a three dimensional high performance interconnection packageIBM·Filed 1994·Granted Jul 2, 1996·328 cites·15 claims
- 0997US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 1097US6335104B1Method for preparing a conductive pad for electrical connection and conductive pad formedIBM·Filed 2000·Granted Jan 1, 2002·155 cites·45 claims
- 1197US6332270B2Method of making high density integral test probeIBM·Filed 1998·Granted Dec 25, 2001·231 cites·12 claims
- 1297US6078259ARadio frequency identification tagINTERMEC IP CORP·Filed 1997·Granted Jun 20, 2000·210 cites·18 claims
- 1397US5972156AMethod of making a radio frequency identification tagINTERMEC IP CORP·Filed 1997·Granted Oct 26, 1999·219 cites·24 claims
- 1497US5299939ASpring array connectorIBM·Filed 1992·Granted Apr 5, 1994·259 cites·18 claims
- 1596US8764968B2DNA sequencing using multiple metal layer structure with organic coatings forming transient bonding to DNA basesAFZALI-ARDAKANI ALI·Filed 2012·Granted Jul 1, 2014·19 cites·5 claims
- 1696US7538565B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1999·Granted May 26, 2009·112 cites·40 claims
- 1796US6534863B2Common ball-limiting metallurgy for I/O sitesIBM·Filed 2001·Granted Mar 18, 2003·112 cites·17 claims
- 1896US6323128B1Method for forming Co-W-P-Au filmsIBM·Filed 1999·Granted Nov 27, 2001·292 cites·20 claims
- 1996US5198153AElectrically conductive polymericIBM·Filed 1989·Granted Mar 30, 1993·232 cites·16 claims
- 2095US6351134B2Semiconductor wafer test and burn-inIBM·Filed 1999·Granted Feb 26, 2002·127 cites·24 claims
- 2195US4975079AConnector assembly for chip testingIBM·Filed 1990·Granted Dec 4, 1990·240 cites·10 claims
- 2294US5433631AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1994·Granted Jul 18, 1995·85 cites·5 claims
- 2394US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 2493US5239447AStepped electronic device packageIBM·Filed 1991·Granted Aug 24, 1993·199 cites·9 claims
- 2591US6104201AMethod and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltageIBM·Filed 1998·Granted Aug 15, 2000·82 cites·10 claims
- 2691US5929651ASemiconductor wafer test and burn-inIBM·Filed 1996·Granted Jul 27, 1999·80 cites·41 claims
- 2791US5582858AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1995·Granted Dec 10, 1996·113 cites·14 claims
- 2891US5357234ACurrent limiting fuseGOULD ELECTRONICS INC·Filed 1993·Granted Oct 18, 1994·62 cites·31 claims
- 2991US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 3090US6646345B2Method for forming Co-W-P-Au filmsIBM·Filed 2001·Granted Nov 11, 2003·45 cites·5 claims
- 3189US5837119AMethods of fabricating dendritic powder materials for high conductivity paste applicationsIBM·Filed 1996·Granted Nov 17, 1998·60 cites·28 claims
- 3288US5838160AIntegral rigid chip test probeIBM·Filed 1996·Granted Nov 17, 1998·99 cites·5 claims
- 3387US9471623B2Empathy injection for question-answering systemsIBM·Filed 2013·Granted Oct 18, 2016·14 cites·18 claims
- 3487US9298766B2Empathy injection for question-answering systemsIBM·Filed 2013·Granted Mar 29, 2016·10 cites·18 claims
- 3587US5441690AProcess of making pinless connectorIBM·Filed 1993·Granted Aug 15, 1995·94 cites·3 claims
- 3687US5326643AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1991·Granted Jul 5, 1994·41 cites·31 claims
- 3786US10592503B2Empathy injection for question-answering systemsIBM·Filed 2016·Granted Mar 17, 2020·5 cites·18 claims
- 3886US5386344AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1993·Granted Jan 31, 1995·51 cites·18 claims
- 3986US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 4085US6819000B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2003·Granted Nov 16, 2004·28 cites·4 claims
- 4184US5958590ADendritic powder materials for high conductivity paste applicationsIBM·Filed 1995·Granted Sep 28, 1999·72 cites·8 claims
- 4283US6551931B1Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so cappedIBM·Filed 2000·Granted Apr 22, 2003·27 cites·23 claims
- 4382US8641879B2Charged entities as locomotive to control motion of polymers through a nanochannelHARRER STEFAN·Filed 2012·Granted Feb 4, 2014·2 cites·9 claims
- 4479US5813870ASelectively filled adhesives for semiconductor chip interconnection and encapsulationIBM·Filed 1996·Granted Sep 29, 1998·55 cites·22 claims
- 4578US8878259B2Super lattice/quantum well nanowiresHOVEL HAROLD J·Filed 2012·Granted Nov 4, 2014·3 cites·24 claims
- 4678US6661098B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2002·Granted Dec 9, 2003·18 cites·16 claims
- 4777US6927472B2Fuse structure and method to form the sameIBM·Filed 2001·Granted Aug 9, 2005·20 cites·15 claims
- 4875US6784088B2Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so cappedIBM·Filed 2003·Granted Aug 31, 2004·16 cites·10 claims
- 4975US6362557B1Ultrasonic method and actuator for inducing motion of an objectIBM·Filed 2000·Granted Mar 26, 2002·17 cites·8 claims
- 5074US5599582AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1995·Granted Feb 4, 1997·25 cites·10 claims
Showing the top 50 of 141 patent records by PatentIndex Score.
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