Inventor · disambiguated record
Brian S. Beaman
Also filed as: BEAMAN BRIAN · BEAMAN BRIAN S · BEAMAN BRIAN SAMUEL
107 granted patents·62 pending applications·6,641 citations·filing 1989–2022
99Inventor score
Files withIBM134BEAMAN BRIAN S13BEAMAN BRIAN SAMUEL7HOUGHAM GARETH G7LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD3
Top patents by PatentIndex Score
169 records- 0199US9561852B1In flight transfer of packages between aerial dronesIBM·Filed 2016·Granted Feb 7, 2017·131 cites·20 claims
- 0299US6708403B2Angled flying lead wire bonding processIBM·Filed 2003·Granted Mar 23, 2004·194 cites·31 claims
- 0399US6526655B2Angled flying lead wire bonding processIBM·Filed 2001·Granted Mar 4, 2003·188 cites·26 claims
- 0499US6334247B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1997·Granted Jan 1, 2002·277 cites·80 claims
- 0599US5821763ATest probe for high density integrated circuits, methods of fabrication thereof and methods of use thereofIBM·Filed 1996·Granted Oct 13, 1998·349 cites·13 claims
- 0699US5635846ATest probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformerIBM·Filed 1993·Granted Jun 3, 1997·342 cites·7 claims
- 0799US5371654AThree dimensional high performance interconnection packageIBM·Filed 1992·Granted Dec 6, 1994·503 cites·25 claims
- 0899US4998885AElastomeric area array interposerIBM·Filed 1989·Granted Mar 12, 1991·387 cites·8 claims
- 0998US7331796B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2006·Granted Feb 19, 2008·50 cites·7 claims
- 1098US6380485B1Enhanced wire termination for twinax wiresIBM·Filed 2000·Granted Apr 30, 2002·222 cites·18 claims
- 1198US6300780B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1998·Granted Oct 9, 2001·197 cites·17 claims
- 1298US6206273B1Structures and processes to create a desired probetip contact geometry on a wafer test probeIBM·Filed 1999·Granted Mar 27, 2001·206 cites·9 claims
- 1397US7832095B2Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·24 cites·3 claims
- 1497US7495342B2Angled flying lead wire bonding processIBM·Filed 2003·Granted Feb 24, 2009·109 cites·29 claims
- 1597US6332270B2Method of making high density integral test probeIBM·Filed 1998·Granted Dec 25, 2001·231 cites·12 claims
- 1697US6295729B1Angled flying lead wire bonding processIBM·Filed 1998·Granted Oct 2, 2001·206 cites·8 claims
- 1797US6062879AHigh density test probe with rigid surface structureIBM·Filed 1998·Granted May 16, 2000·150 cites·7 claims
- 1897US5810607AInterconnector with contact pads having enhanced durabilityIBM·Filed 1995·Granted Sep 22, 1998·244 cites·18 claims
- 1997US5785538AHigh density test probe with rigid surface structureIBM·Filed 1996·Granted Jul 28, 1998·147 cites·17 claims
- 2096US7665999B2Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2008·Granted Feb 23, 2010·19 cites·3 claims
- 2196US7538565B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1999·Granted May 26, 2009·112 cites·40 claims
- 2296US7354277B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 8, 2008·20 cites·4 claims
- 2396US5811982AHigh density cantilevered probe for electronic devicesIBM·Filed 1996·Granted Sep 22, 1998·310 cites·13 claims
- 2495US7836585B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 23, 2010·16 cites·3 claims
- 2595US7832094B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·16 cites·5 claims
- 2695US7823283B2Method of forming a land grid array interposerIBM·Filed 2008·Granted Nov 2, 2010·16 cites·8 claims
- 2795US7484966B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 3, 2009·16 cites·1 claims
- 2895US7361025B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·16 cites·6 claims
- 2995US6722032B2Method of forming a structure for electronic devices contact locationsIBM·Filed 2001·Granted Apr 20, 2004·79 cites·16 claims
- 3095US6528984B2Integrated compliant probe for wafer level test and burn-inIBM·Filed 1997·Granted Mar 4, 2003·178 cites·12 claims
- 3195US4975079AConnector assembly for chip testingIBM·Filed 1990·Granted Dec 4, 1990·240 cites·10 claims
- 3294US10135162B1Method for fabricating a hybrid land grid array connectorIBM·Filed 2017·Granted Nov 20, 2018·8 cites·7 claims
- 3394US8267701B2Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housingBEAMAN BRIAN S·Filed 2010·Granted Sep 18, 2012·23 cites·25 claims
- 3494US6329827B1High density cantilevered probe for electronic devicesIBM·Filed 1998·Granted Dec 11, 2001·107 cites·22 claims
- 3594US5433631AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1994·Granted Jul 18, 1995·85 cites·5 claims
- 3693US8037600B2Method of producing a land grid array interposer structureIBM·Filed 2008·Granted Oct 18, 2011·11 cites·7 claims
- 3793US6452406B1Probe structure having a plurality of discrete insulated probe tipsIBM·Filed 1997·Granted Sep 17, 2002·111 cites·28 claims
- 3893US6286208B1Interconnector with contact pads having enhanced durabilityIBM·Filed 1996·Granted Sep 11, 2001·124 cites·5 claims
- 3993US6078500APluggable chip scale packageIBM·Filed 1998·Granted Jun 20, 2000·149 cites·6 claims
- 4092US10128593B1Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the bodyIBM·Filed 2017·Granted Nov 13, 2018·6 cites·12 claims
- 4192US5914614AHigh density cantilevered probe for electronic devicesIBM·Filed 1997·Granted Jun 22, 1999·130 cites·8 claims
- 4291US6104201AMethod and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltageIBM·Filed 1998·Granted Aug 15, 2000·82 cites·10 claims
- 4390US7368924B2Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereofIBM·Filed 2002·Granted May 6, 2008·34 cites·47 claims
- 4489US10756009B1Efficient placement of grid array componentsIBM·Filed 2019·Granted Aug 25, 2020·5 cites·10 claims
- 4589US9252521B1Short path circuit cardLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2014·Granted Feb 2, 2016·20 cites·10 claims
- 4688US5838160AIntegral rigid chip test probeIBM·Filed 1996·Granted Nov 17, 1998·99 cites·5 claims
- 4787US5441690AProcess of making pinless connectorIBM·Filed 1993·Granted Aug 15, 1995·94 cites·3 claims
- 4886US7658616B2Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposersIBM·Filed 2008·Granted Feb 9, 2010·5 cites·1 claims
- 4986US5386344AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1993·Granted Jan 31, 1995·51 cites·18 claims
- 5084US7467951B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Dec 23, 2008·4 cites·4 claims
Showing the top 50 of 169 patent records by PatentIndex Score.
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