Inventor · disambiguated record
Yeh Hsu
Also filed as: HSU YEH · HSU YEH-CHI
23 granted patents·1 pending application·105 citations·filing 2009–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12CHANG WEN YUAN3VIA TECH INC3SHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD2VIA ALLIANCE SEMICONDUCTOR CO LTD2
Top patents by PatentIndex Score
24 records- 0197US9196730B1Variable channel strain of nanowire transistors to improve drive currentTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 24, 2015·29 cites·17 claims
- 0294US10504847B2Chip package structure and chip package structure arraySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Dec 10, 2019·14 cites·22 claims
- 0392US10204852B2Circuit substrate and semiconductor package structureVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 12, 2019·8 cites·9 claims
- 0490US9418964B2Chip package structureCHANG WEN-YUAN·Filed 2012·Granted Aug 16, 2016·13 cites·18 claims
- 0588US9620591B2Semiconductor structures and methods for multi-level work function and multi-valued channel doping of nanowire transistors to improve drive currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 11, 2017·6 cites·15 claims
- 0688US9224814B2Process design to improve transistor variations and performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 29, 2015·7 cites·20 claims
- 0784US9484460B2Semiconductor device having gate dielectric surrounding at least some of channel region and gate electrode surrounding at least some of gate dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 1, 2016·4 cites·20 claims
- 0880US9536746B2Recess and epitaxial layer to improve transistor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 3, 2017·4 cites·20 claims
- 0979US9728602B2Variable channel strain of nanowire transistors to improve drive currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·2 cites·20 claims
- 1075US8736079B2Pad structure, circuit carrier and integrated circuit chipCHEN YU-KAI·Filed 2011·Granted May 27, 2014·5 cites·14 claims
- 1173US9634132B2Semiconductor structures and methods for multi-level band gap energy of nanowire transistors to improve drive currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 25, 2017·3 cites·17 claims
- 1271US9716172B2Semiconductor device having multiple active area layers and its formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 25, 2017·2 cites·20 claims
- 1370US7906377B2Fabrication method of circuit boardVIA TECH INC·Filed 2009·Granted Mar 15, 2011·3 cites·5 claims
- 1467US10276664B2Semiconductor structures and methods for multi-dimension of nanowire diameter to improve drive currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 30, 2019·2 cites·22 claims
- 1564US9525031B2Epitaxial channelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 20, 2016·1 cites·17 claims
- 1663US8698325B2Integrated circuit package and physical layer interface arrangementCHANG WEN-YUAN·Filed 2011·Granted Apr 15, 2014·2 cites·17 claims
- 1762US10734503B2Asymmetric semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 1861US2025239530A1Electronic package and manufacturing method of electronic packageVIA TECH INC·Filed 2024·Application pending·0 cites
- 1957US10026826B2Method of forming semiconductor device having gate dielectric surrounding at least some of channel region and gate electrode surrounding at least some of gate dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 17, 2018·0 cites·20 claims
- 2052US8796848B2Circuit board and chip package structureCHANG WEN-YUAN·Filed 2011·Granted Aug 5, 2014·0 cites·15 claims
- 2151US12506060B2Package substrate, chip package and integrated circuit chipVIA TECH INC·Filed 2022·Granted Dec 23, 2025·0 cites·25 claims
- 2251US9768297B2Process design to improve transistor variations and performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·0 cites·20 claims
- 2349US9601425B2Circuit substrate and semiconductor package structureVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2015·Granted Mar 21, 2017·0 cites·11 claims
- 2441US10756077B2Chip packaging methodSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 25, 2020·0 cites·11 claims
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