Inventor · disambiguated record
Michael Ledutke
Also filed as: LEDUTKE MICHAEL
8 granted patents·1 pending application·16 citations·filing 2013–2022
79Inventor score
Files withINFINEON TECHNOLOGIES AG9
Top patents by PatentIndex Score
9 records- 0192US10128165B2Package with vertically spaced partially encapsulated contact structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·11 cites·25 claims
- 0282US10435292B2Method for producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·2 cites·21 claims
- 0373US9698070B2Arrangement having a plurality of chips and a chip carrier, and a processing arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 4, 2017·2 cites·15 claims
- 0465US11040872B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 0556US9202753B2Semiconductor devices and methods of producing theseINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 1, 2015·1 cites·21 claims
- 0655US12062589B2Semiconductor packages including recesses to contain solderINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 0755US10361138B2Method for manufacturing an arrangement including a chip carrier notchINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 23, 2019·0 cites·19 claims
- 0846US2022415732A1Semiconductor module with shaped external contact for reduced crack formation in the encapsulation bodyINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0940US10923364B2Methods for producing packaged semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
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