Inventor · disambiguated record
Koji Komemura
Also filed as: KOMEMURA KOJI
4 granted patents·1 pending application·3 citations·filing 2014–2017
60Inventor score
Files withFUJITSU LTD5
Top patents by PatentIndex Score
5 records- 0173US10109571B2Wiring substrate and manufacturing method of wiring substrateFUJITSU LTD·Filed 2016·Granted Oct 23, 2018·2 cites·10 claims
- 0264US9769936B2Production method of circuit boardFUJITSU LTD·Filed 2014·Granted Sep 19, 2017·1 cites·4 claims
- 0350US9192058B2Method for manufacturing component built-in substrateFUJITSU LTD·Filed 2014·Granted Nov 17, 2015·0 cites·12 claims
- 0443US10327340B2Circuit board, production method of circuit board, and electronic equipmentFUJITSU LTD·Filed 2017·Granted Jun 18, 2019·0 cites·7 claims
- 0533US2016338193A1Multilayer board and method of manufacturing multilayer boardFUJITSU LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →