Inventor · disambiguated record
Rahul Jairath
Also filed as: JAIRATH RAHUL
19 granted patents·1 pending application·1,313 citations·filing 1994–2018
97Inventor score
Files withLAM RES CORP11NAT SEMICONDUCTOR CORP3ONTRAK SYSTEMS INC2SEMATECH INC2ACCENTURE GLOBAL SOLUTIONS LTD1
Top patents by PatentIndex Score
20 records- 0195US5762536ASensors for a linear polisherLAM RES CORP·Filed 1997·Granted Jun 9, 1998·150 cites·20 claims
- 0294US5866031ASlurry formulation for chemical mechanical polishing of metalsSEMATECH INC·Filed 1996·Granted Feb 2, 1999·108 cites·25 claims
- 0393US6111634AMethod and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishingLAM RES CORP·Filed 1997·Granted Aug 29, 2000·155 cites·21 claims
- 0491US6855239B1Plating method and apparatus using contactless electrodeFiled 2002·Granted Feb 15, 2005·29 cites·41 claims
- 0591US6621584B2Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishingLAM RES CORP·Filed 2000·Granted Sep 16, 2003·36 cites·22 claims
- 0691US6146248AMethod and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisherLAM RES CORP·Filed 1997·Granted Nov 14, 2000·114 cites·37 claims
- 0791US6108091AMethod and apparatus for in-situ monitoring of thickness during chemical-mechanical polishingLAM RES CORP·Filed 1997·Granted Aug 22, 2000·86 cites·27 claims
- 0890US5478435APoint of use slurry dispensing systemNAT SEMICONDUCTOR CORP·Filed 1994·Granted Dec 26, 1995·161 cites·16 claims
- 0989US5614444AMethod of using additives with silica-based slurries to enhance selectivity in metal CMPSEMATECH INC·Filed 1995·Granted Mar 25, 1997·133 cites·14 claims
- 1088US6261155B1Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisherLAM RES CORP·Filed 2000·Granted Jul 17, 2001·42 cites·20 claims
- 1187US5665656AMethod and apparatus for polishing a semiconductor substrate waferNAT SEMICONDUCTOR CORP·Filed 1995·Granted Sep 9, 1997·40 cites·12 claims
- 1284US6328642B1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 1997·Granted Dec 11, 2001·66 cites·19 claims
- 1383US5913714AMethod for dressing a polishing pad during polishing of a semiconductor waferONTRAK SYSTEMS INC·Filed 1998·Granted Jun 22, 1999·47 cites·1 claims
- 1483US5857899AWafer polishing head with pad dressing elementONTRAK SYSTEMS INC·Filed 1997·Granted Jan 12, 1999·49 cites·13 claims
- 1580US5688360AMethod and apparatus for polishing a semiconductor substrate waferNAT SEMICONDUCTOR CORP·Filed 1996·Granted Nov 18, 1997·29 cites·19 claims
- 1679US6517418B2Method of transporting a semiconductor wafer in a wafer polishing systemLAM RES CORP·Filed 2001·Granted Feb 11, 2003·18 cites·15 claims
- 1779US6336845B1Method and apparatus for polishing semiconductor wafersLAM RES CORP·Filed 1997·Granted Jan 8, 2002·45 cites·25 claims
- 1857US6656025B2Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2001·Granted Dec 2, 2003·5 cites·13 claims
- 1940US2005118936A1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2003·Application pending·0 cites
- 2038US10762524B2Data platform and analytics for predicting media metricsACCENTURE GLOBAL SOLUTIONS LTD·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
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