Inventor · disambiguated record
Shusaku Tagami
Also filed as: TAGAMI SHUSAKU
3 granted patents·3 pending applications·11 citations·filing 2002–2023
63Inventor score
Top patents by PatentIndex Score
6 records- 0177US9238314B2Method for resin molding and resin molding apparatusAPIC YAMADA CORP·Filed 2012·Granted Jan 19, 2016·3 cites·8 claims
- 0267US9738014B2Resin molding machineMAEYAMA TETSUYA·Filed 2011·Granted Aug 22, 2017·5 cites·16 claims
- 0354US2025096015A1Resin sealing device and resin sealing methodAPIC YAMADA CORP·Filed 2023·Application pending·0 cites
- 0453US2025167016A1Resin sealing device and resin sealing methodAPIC YAMADA CORP·Filed 2023·Application pending·0 cites
- 0550US2024116224A1Compression molding deviceAPIC YAMADA CORP·Filed 2022·Application pending·0 cites
- 0642US7175405B2Compression molding machineAPIC YAMADA CORP·Filed 2002·Granted Feb 13, 2007·3 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →