Inventor · disambiguated record
Kenichirou Katou
Also filed as: KATOU KENICHIROU
2 granted patents·1 pending application·12 citations·filing 1998–2006
55Inventor score
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3 records- 0144US2006237087A1Method of forming leads of a packaged semiconductor deviceRENESAS DEVICE DESIGN CORP·Filed 2006·Application pending·0 cites
- 0242US7077170B2Method of forming leads of a semiconductor deviceRENESAS DEVICE DESIGN CORP·Filed 2003·Granted Jul 18, 2006·2 cites·8 claims
- 0335US6242287B1Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resinMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jun 5, 2001·10 cites·10 claims
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