Inventor · disambiguated record
Chikara Aikawa
Also filed as: AIKAWA CHIKARA
3 granted patents·7 pending applications·4 citations·filing 2009–2024
56Inventor score
Top patents by PatentIndex Score
10 records- 0170US2025018501A1Method and device for adjusting optical axis of laser lightTOKYO SEIMITSU CO LTD·Filed 2024·Application pending·0 cites
- 0268US2025018504A1Laser optical system and adjustment method therefor, and laser machining device and methodTOKYO SEIMITSU CO LTD·Filed 2024·Application pending·0 cites
- 0362US9054179B2Wafer processing methodDISCO CORP·Filed 2014·Granted Jun 9, 2015·1 cites·5 claims
- 0460US10276413B2Laser processing apparatusDISCO CORP·Filed 2015·Granted Apr 30, 2019·1 cites·15 claims
- 0556US8642920B2Wafer dividing apparatus and laser processing apparatusAIKAWA CHIKARA·Filed 2010·Granted Feb 4, 2014·2 cites·10 claims
- 0654US2025018502A1Laser light correction methodTOKYO SEIMITSU CO LTD·Filed 2024·Application pending·0 cites
- 0753US2023264292A1Laser machining apparatus and laser machining methodTOKYO SEIMITSU CO LTD·Filed 2023·Application pending·0 cites
- 0843US2010044590A1Laser processing methodDISCO CORP·Filed 2009·Application pending·0 cites
- 0937US2013122619A1Optical device wafer processing methodDISCO CORP·Filed 2012·Application pending·0 cites
- 1032US2015214432A1Optical device and manufacturing method thereforDISCO CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →