Inventor · disambiguated record
Paul D. Bantz
Also filed as: BANTZ PAUL · BANTZ PAUL D
3 granted patents·2 pending applications·39 citations·filing 2011–2013
67Inventor score
Top patents by PatentIndex Score
5 records- 0190US8908383B1Thermal via structures with surface featuresRAILKAR TARAK A·Filed 2012·Granted Dec 9, 2014·16 cites·19 claims
- 0289US8487435B2Sheet-molded chip-scale packageJUSKEY FRANK J·Filed 2011·Granted Jul 16, 2013·23 cites·18 claims
- 0348US9585240B2Advanced grounding schemeTRIQUINT SEMICONDUCTOR INC·Filed 2013·Granted Feb 28, 2017·0 cites·19 claims
- 0448US2014106511A1Flip-chip packaging techniques and configurationsTRIQUINT SEMICONDUCTOR INC·Filed 2013·Application pending·0 cites
- 0543US2013234344A1Flip-chip packaging techniques and configurationsJUSKEY FRANK J·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →