Inventor · disambiguated record
Chun-Yi Cheng
Also filed as: CHENG CHUN-YI
7 granted patents·10 pending applications·18 citations·filing 2005–2025
77Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6ASUSTEK COMP INC3CHENG CHUN-YI2IND TECH RES INST2VOLTRON MICROELECTRONICS CORP2
Top patents by PatentIndex Score
17 records- 0180US7525795B2Hard disk drive holding deviceASUSTEK COMP INC·Filed 2006·Granted Apr 28, 2009·13 cites·14 claims
- 0271US10522438B2Package structure having under ball release layer and manufacturing method thereofIND TECH RES INST·Filed 2017·Granted Dec 31, 2019·2 cites·11 claims
- 0370US2025287610A1Integrated circuit structure and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0469US12336190B2Integrated circuit structure and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0566US10886731B2Over-voltage protection circuit for USB Type-C connectorVOLTRON MICROELECTRONICS CORP·Filed 2019·Granted Jan 5, 2021·1 cites·6 claims
- 0665US10573587B2Package structure and manufacturing method thereofIND TECH RES INST·Filed 2017·Granted Feb 25, 2020·1 cites·9 claims
- 0758US11655348B2Method for manufacturing polyimide composite film for flexible metal-clad substrateTAIMIDE TECH INCORPORATION·Filed 2021·Granted May 23, 2023·0 cites·7 claims
- 0857US2025081604A1Three dimensional integrated circuit and fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0956US2024347536A1Integrated circuit and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1056US2025359242A1Semiconductor device with backside viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1154US7612995B2Shockproof locking assembly deviceASUSTEK COMP INC·Filed 2006·Granted Nov 3, 2009·1 cites·19 claims
- 1254US2024339530A1Integrated circuit and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1342US2007113675A1Circuit board clamping mechanism and testing device using the sameASUSTEK COMP INC·Filed 2006·Application pending·0 cites
- 1441US2007072658A1Clam Type Mobile PhoneCHENG CHUN-YI·Filed 2006·Application pending·0 cites
- 1540US2006130083A1Shockproof locking assembly deviceCHENG CHUN-YI·Filed 2005·Application pending·0 cites
- 1638US2006157904A1Apparatus for fixing a workpiece and fixing unit thereofLI YU-CHI·Filed 2006·Application pending·0 cites
- 1729US2019252331A1High-voltage capacitor structure and digital isolation apparatusVOLTRON MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →