Inventor · disambiguated record
Shosaku Ishihara
Also filed as: ISHIHARA SHOSAKU
10 granted patents·5 pending applications·53 citations·filing 1984–2016
87Inventor score
Top patents by PatentIndex Score
15 records- 0172US10247630B2Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating methodHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Apr 2, 2019·2 cites·18 claims
- 0271US7193319B2Semiconductor deviceHITACHI LTD·Filed 2005·Granted Mar 20, 2007·6 cites·8 claims
- 0368US7498671B2Power semiconductor moduleHITACHI LTD·Filed 2007·Granted Mar 3, 2009·4 cites·8 claims
- 0464US7423349B2Semiconductor deviceHITACHI LTD·Filed 2006·Granted Sep 9, 2008·3 cites·20 claims
- 0562US6248960B1Ceramics substrate with electronic circuit and its manufacturing methodHITACHI LTD·Filed 2000·Granted Jun 19, 2001·9 cites·9 claims
- 0660US7719100B2Power semiconductor module with MOS chipHITACHI LTD·Filed 2006·Granted May 18, 2010·2 cites·10 claims
- 0752US6798059B1Multilayer electronic part, its manufacturing method, two-dimensionally arrayed element packaging structure, and its manufacturing methodHITACHI LTD·Filed 1999·Granted Sep 28, 2004·16 cites·22 claims
- 0845US4604496ACeramic multilayer wiring boardHITACHI LTD·Filed 1984·Granted Aug 5, 1986·9 cites·6 claims
- 0944US2011206985A1Lithium secondary battery and method for manufacturing the sameHITACHI LTD·Filed 2010·Application pending·0 cites
- 1043US6658733B2Method of manufacturing via interconnection of glass-ceramic wiring boardHITACHI LTD·Filed 2001·Granted Dec 9, 2003·1 cites·3 claims
- 1143US6384347B2Glass-ceramic wiring boardHITACHI LTD·Filed 2001·Granted May 7, 2002·1 cites·8 claims
- 1241US2008261001A1Mounting Substrate Suitable for Use to Install Surface Mount ComponentsNAKATSUKA TETSUYA·Filed 2005·Application pending·0 cites
- 1338US2009312938A1Gas sensor, oxygen sensor and air-fuel ratio control systemHITACHI LTD·Filed 2009·Application pending·0 cites
- 1437US2011244262A1Metal Bonding Member and Fabrication Method of the SameHITACHI LTD·Filed 2010·Application pending·0 cites
- 1537US2001026444A1Electronic circuit board with built-in thin film capacitor and manufacturing method thereofFiled 2001·Application pending·0 cites
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