Inventor · disambiguated record
Dean Wang
Also filed as: WANG DEAN · WANG DEAN C · WANG DEAN-CHUNG
19 granted patents·5 pending applications·114 citations·filing 1998–2023
93Inventor score
Files withGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD6INVENTEC PUDONG TECH CORP3TAIWAN SEMICONDUCTOR MFG CO LTD3TAIWAN SEMICONDUCTOR MFG2WANG DEAN2
Top patents by PatentIndex Score
24 records- 0193US9984999B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·6 cites·20 claims
- 0291US7851346B2Bonding metallurgy for three-dimensional interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Dec 14, 2010·22 cites·19 claims
- 0385US9467380B2Data center network flow migration method and system thereofINVENTEC PUDONG TECH CORP·Filed 2015·Granted Oct 11, 2016·8 cites·9 claims
- 0484US9462521B2Data center network provisioning method and system thereofINVENTEC PUDONG TECH CORP·Filed 2015·Granted Oct 4, 2016·7 cites·8 claims
- 0583US12273644B2Image sensor and image sensing method judging whether a digital sensing signal is abnormalGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·15 claims
- 0683US12256167B2Image sensor and image sensing methodGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0782US8334170B2Method for stacking devicesWANG DEAN·Filed 2008·Granted Dec 18, 2012·10 cites·14 claims
- 0879US10807957B2Tetradentate chelating monoquinoline derivative, manufacturing method thereof, and application of same as metal ion regulator for neurodegenerative diseaseUNIV GUANGDONG TECHNOLOGY·Filed 2018·Granted Oct 20, 2020·2 cites·3 claims
- 0979US8242611B2Bonding metallurgy for three-dimensional interconnectLEE BO-I·Filed 2010·Granted Aug 14, 2012·5 cites·20 claims
- 1078US12254822B2Display device capable of in-display sensingGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·7 claims
- 1178US12212860B2Image sensor circuit and image sensor deviceGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1276US2023388610A1Image sensing device and image sensing method thereofGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD·Filed 2023·Application pending·0 cites
- 1369US8932906B2Through silicon via bonding structureWANG DEAN·Filed 2008·Granted Jan 13, 2015·4 cites·20 claims
- 1466US7888236B2Semiconductor device and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 15, 2011·3 cites·10 claims
- 1562US12151628B2Active condensation mitigation inside electronic enclosureGM CRUISE HOLDINGS LLC·Filed 2022·Granted Nov 26, 2024·0 cites·8 claims
- 1660US7209999B2Expansion device for storage unitsINVENTEC CORP·Filed 2004·Granted Apr 24, 2007·9 cites·3 claims
- 1756US6233250B1System and method for reducing latency in software modem for high-speed synchronous transmissionINTEGRATED TELECOM EXPRESS INC·Filed 1998·Granted May 15, 2001·38 cites·62 claims
- 1854US12375824B2Dynamic vision sensorGUANGZHOU TYRAFOS SEMICONDUCTOR TECH CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·16 claims
- 1953US9659918B2POP structures with dams encircling air gaps and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·0 cites·20 claims
- 2049US2013127049A1Method for Stacking Devices and Structure ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Application pending·0 cites
- 2146US11121261B2Semiconductor substrateAU OPTRONICS CORP·Filed 2020·Granted Sep 14, 2021·0 cites·22 claims
- 2239US2001005367A1xDSL modem with asynchronous transfer mode (ATM) layer & latency reduction implemented in softwareFiled 2001·Application pending·0 cites
- 2334US2006271810A1Backup control system and methodINVENTEC CORP & 3UP SYSTEMS IN·Filed 2005·Application pending·0 cites
- 2429US2016154676A1Method of Resource Allocation in a Server SystemINVENTEC PUDONG TECH CORP·Filed 2015·Application pending·0 cites
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