Inventor · disambiguated record

So Hikosaka

Also filed as: HIKOSAKA SO

1 granted patent·0 citations·filing 2021–2021

1Inventor score

Technology areasH10W

Files withKIOXIA CORP1

Top patents by PatentIndex Score

1 record

0145US12500172B23D semiconductor memory device including inter-finger structure and interlayer insulating layers configured to absorb compressing stressKIOXIA CORP·Filed 2021·Granted Dec 16, 2025·0 cites·12 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →