Inventor · disambiguated record
Tsunetoshi Arikado
Also filed as: ARIKADO TSUNETOSHI
21 granted patents·3 pending applications·747 citations·filing 1983–2008
96Inventor score
Files withTOSHIBA KK19NEC ELECTRONICS CORP2KABUSHIKIA KAISHA TOSHIBA1TOKYO ELECTRON LTD1TOKYO SHIBAURA ELECTRIC CO1
Top patents by PatentIndex Score
24 records- 0195US6617226B1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2000·Granted Sep 9, 2003·75 cites·4 claims
- 0294US6717251B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 6, 2004·103 cites·26 claims
- 0392US6015990ASemiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 1998·Granted Jan 18, 2000·109 cites·14 claims
- 0488US5298112AMethod for removing composite attached to material by dry etchingTOSHIBA KK·Filed 1992·Granted Mar 29, 1994·103 cites·36 claims
- 0587US7268047B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2006·Granted Sep 11, 2007·12 cites·8 claims
- 0685US7057259B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themTOSHIBA KK·Filed 2002·Granted Jun 6, 2006·35 cites·38 claims
- 0784US4838978ADry etching apparatusTOSHIBA KK·Filed 1987·Granted Jun 13, 1989·70 cites·13 claims
- 0883US6351006B1Ferroelectric capacitor with means to prevent deteriorationTOSHIBA KK·Filed 1999·Granted Feb 26, 2002·55 cites·12 claims
- 0982US6865513B2Method for predicting life of rotary machine and determining repair timing of rotary machineTOSHIBA KK·Filed 2002·Granted Mar 8, 2005·18 cites·18 claims
- 1081US7101753B2Method for manufacturing a semiconductor device and method for forming high-dielectric-constant filmNEC ELECTRONICS CORP·Filed 2004·Granted Sep 5, 2006·21 cites·12 claims
- 1177US7700381B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themKABUSHIKIA KAISHA TOSHIBA·Filed 2006·Granted Apr 20, 2010·9 cites·1 claims
- 1274US4473437ADry etching method for organic material layersTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Sep 25, 1984·36 cites·6 claims
- 1372US6944572B2Apparatus for predicting life of rotary machine and equipment using the sameTOSHIBA KK·Filed 2004·Granted Sep 13, 2005·15 cites·22 claims
- 1467US6989316B2Semiconductor device and method for manufacturingTOSHIBA KK·Filed 2003·Granted Jan 24, 2006·9 cites·1 claims
- 1566US4878995AMethod of dry etching and apparatus for use in such methodTOSHIBA KK·Filed 1988·Granted Nov 7, 1989·30 cites·34 claims
- 1661US6483083B2Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surfaceTOSHIBA KK·Filed 2001·Granted Nov 19, 2002·7 cites·11 claims
- 1759US6265696B1Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surfaceTOSHIBA KK·Filed 1999·Granted Jul 24, 2001·21 cites·9 claims
- 1857US7042790B2Semiconductor device, sales method for semiconductor device, sales system for semiconductor device and program product storing sales program for semiconductor deviceTOSHIBA KK·Filed 2001·Granted May 9, 2006·0 cites·7 claims
- 1955US7034369B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2004·Granted Apr 25, 2006·5 cites·15 claims
- 2053US7772671B2Semiconductor device having an element isolating insulating filmTOSHIBA KK·Filed 2008·Granted Aug 10, 2010·0 cites·4 claims
- 2150US2006273408A1Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2249US4510173AMethod for forming flattened filmTOSHIBA KK·Filed 1984·Granted Apr 9, 1985·14 cites·14 claims
- 2346US2011001197A1Method for manufacturing semiconductor device and semiconductor deviceTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 2440US2004070045A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2003·Application pending·0 cites
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