Inventor · disambiguated record
Ye Seul Nam
Also filed as: NAM YE SEUL
2 granted patents·2 pending applications·25 citations·filing 2017–2023
60Inventor score
Technology areasH10W
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0196US10319896B2Shielded interconnectsINTEL CORP·Filed 2017·Granted Jun 11, 2019·19 cites·25 claims
- 0288US10256206B2Qubit die attachment using preformsINTEL CORP·Filed 2018·Granted Apr 9, 2019·6 cites·20 claims
- 0352US2024395567A1Selective underfilling using pre-applied thermoset adhesiveINTEL CORP·Filed 2023·Application pending·0 cites
- 0450US2024321807A1Barrier dispensing combined with non-conductive paste to enable packages with restricted underfill areasINTEL CORP·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →