Inventor · disambiguated record

Taizo Kise

Also filed as: KISE TAIZO

1 granted patent·1 pending application·4 citations·filing 2007–2023

24Inventor score

Technology areasB26D H10P

Files withDISCO CORP2

Top patents by PatentIndex Score

2 records

0173US7544587B2Wafer dividing method and wafer dividing apparatusDISCO CORP·Filed 2007·Granted Jun 9, 2009·4 cites·5 claims
0247US2023219164A1Laser processing apparatusDISCO CORP·Filed 2023·Application pending·0 cites

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