Inventor · disambiguated record
Rod Kistler
Also filed as: KISTLER ROD
10 granted patents·1 pending application·160 citations·filing 2000–2004
90Inventor score
Files withLAM RES CORP10
Top patents by PatentIndex Score
11 records- 0194US6340326B1System and method for controlled polishing and planarization of semiconductor wafersLAM RES CORP·Filed 2000·Granted Jan 22, 2002·48 cites·13 claims
- 0286US6607425B1Pressurized membrane platen design for improving performance in CMP applicationsLAM RES CORP·Filed 2000·Granted Aug 19, 2003·31 cites·29 claims
- 0381US6705930B2System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniquesLAM RES CORP·Filed 2001·Granted Mar 16, 2004·23 cites·14 claims
- 0474US6869337B2System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniquesLAM RES CORP·Filed 2004·Granted Mar 22, 2005·14 cites·10 claims
- 0570US6776695B2Platen design for improving edge performance in CMP applicationsLAM RES CORP·Filed 2000·Granted Aug 17, 2004·11 cites·18 claims
- 0669US6808442B1Apparatus for removal/remaining thickness profile manipulationLAM RES CORP·Filed 2001·Granted Oct 26, 2004·12 cites·22 claims
- 0763US6767428B1Method and apparatus for chemical mechanical planarizationLAM RES CORP·Filed 2001·Granted Jul 27, 2004·8 cites·13 claims
- 0857US6913521B2Methods using active retainer rings for improving edge performance in CMP applicationsLAM RES CORP·Filed 2004·Granted Jul 5, 2005·5 cites·18 claims
- 0954US7033250B2Method for chemical mechanical planarizationLAM RES CORP·Filed 2004·Granted Apr 25, 2006·4 cites·11 claims
- 1053US6729943B2System and method for controlled polishing and planarization of semiconductor wafersLAM RES CORP·Filed 2001·Granted May 4, 2004·4 cites·13 claims
- 1132US2002081945A1Piezoelectric platen design for improving performance in CMP applicationsFiled 2000·Application pending·0 cites
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