Inventor · disambiguated record
Lingyun Wei
Also filed as: WEI LINGYUN
3 granted patents·8 pending applications·5 citations·filing 2006–2019
57Inventor score
Files withKUHR WERNER G3ROHM & HAAS ELECT MAT3HAMM GARY1LINDSEY JONATHAN S1MATERIALS LLC ROHM AND HAAS ELECTRONIC1
Top patents by PatentIndex Score
11 records- 0178US11401592B2Liner alloy, steel element and methodSSAB ENTPR LLC·Filed 2019·Granted Aug 2, 2022·1 cites·19 claims
- 0267US8323769B2Methods of treating a surface to promote metal plating and devices formedKUHR WERNER G·Filed 2009·Granted Dec 4, 2012·4 cites·6 claims
- 0354US2009056994A1Methods of Treating a Surface to Promote Metal Plating and Devices FormedKUHR WERNER G·Filed 2007·Application pending·0 cites
- 0448US2009056991A1Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed TherefromKUHR WERNER G·Filed 2008·Application pending·0 cites
- 0543US8173630B2Multipodal tethers for high-density attachment of redox-active moieties to substratesLINDSEY JONATHAN S·Filed 2006·Granted May 8, 2012·0 cites·108 claims
- 0641US2017145577A1Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warpingROHM & HAAS ELECT MAT·Filed 2016·Application pending·0 cites
- 0738US2017067173A1Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper depositsROHM & HAAS ELECT MAT·Filed 2016·Application pending·0 cites
- 0833US2013203252A1Activation process to improve metal adhesionMATERIALS LLC ROHM AND HAAS ELECTRONIC·Filed 2013·Application pending·0 cites
- 0932US2016312372A1Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper depositsROHM & HAAS ELECT MAT·Filed 2015·Application pending·0 cites
- 1029US2014174936A1Plating of copper on semiconductorsHAMM GARY·Filed 2012·Application pending·0 cites
- 1126US2014008234A1Method of metal plating semiconductorsWEI LINGYUN·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →