Inventor · disambiguated record
Masazumi Amagai
Also filed as: AMAGAI MASAZUMI
33 granted patents·8 pending applications·930 citations·filing 1994–2023
98Inventor score
Files withTEXAS INSTRUMENTS INC19SAMSUNG ELECTRONICS CO LTD4LINTEC CORP3HITACHI LTD2SENJU METAL INDUSTRY CO2
Top patents by PatentIndex Score
41 records- 0195US7520052B2Method of manufacturing a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2006·Granted Apr 21, 2009·33 cites·27 claims
- 0294US8097964B2IC having TSV arrays with reduced TSV induced stressWEST JEFFREY ALAN·Filed 2009·Granted Jan 17, 2012·39 cites·17 claims
- 0393US5882956AProcess for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1997·Granted Mar 16, 1999·161 cites·9 claims
- 0488US6144102ASemiconductor device packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Nov 7, 2000·99 cites·19 claims
- 0588US6007920AWafer dicing/bonding sheet and process for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1998·Granted Dec 28, 1999·92 cites·5 claims
- 0685US7626274B2Semiconductor device with an improved solder jointTEXAS INSTRUMENTS INC·Filed 2006·Granted Dec 1, 2009·10 cites·14 claims
- 0784US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0883US5960260ASemiconductor device, its manufacturing method, and dicing adhesive element thereforTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 28, 1999·74 cites·13 claims
- 0983US5466888APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1995·Granted Nov 14, 1995·72 cites·6 claims
- 1080US6873059B2Semiconductor package with metal foil attachment filmTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 29, 2005·25 cites·16 claims
- 1179US7971351B2Method of manufacturing a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2009·Granted Jul 5, 2011·6 cites·21 claims
- 1279US6118183ASemiconductor device, manufacturing method thereof, and insulating substrate for sameTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 12, 2000·55 cites·16 claims
- 1374US7786599B2Semiconductor device with an improved solder jointTEXAS INSTRUMENTS INC·Filed 2009·Granted Aug 31, 2010·4 cites·8 claims
- 1473US6762506B2Assembly of semiconductor device and wiring substrateTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 13, 2004·20 cites·8 claims
- 1572US10580728B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 3, 2020·1 cites·23 claims
- 1672US6232661B1Semiconductor device in BGA package and manufacturing method thereofTEXAS INSTRUMENTS INC·Filed 1999·Granted May 15, 2001·47 cites·15 claims
- 1772US5986335ASemiconductor device having a tapeless mountingTEXAS INSTRUMENTS INC·Filed 1996·Granted Nov 16, 1999·41 cites·10 claims
- 1871US11810848B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1969US7701071B2Method for fabricating flip-attached and underfilled semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Apr 20, 2010·3 cites·10 claims
- 2067US6784022B2Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuitsTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 31, 2004·12 cites·17 claims
- 2166US11094623B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 2262US12394703B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 2362US6602803B2Direct attachment semiconductor chip to organic substrateTEXAS INSTRUMENTS INC·Filed 1999·Granted Aug 5, 2003·27 cites·19 claims
- 2461US7029542B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Apr 18, 2006·8 cites·12 claims
- 2558US7042070B2Direct attachment of semiconductor chip to organic substrateTEXAS INSTRUMENTS INC·Filed 2003·Granted May 9, 2006·8 cites·14 claims
- 2658US5406028APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1994·Granted Apr 11, 1995·24 cites·9 claims
- 2757US6297076B1Process for preparing a semiconductor waferLINTEC CORP·Filed 1994·Granted Oct 2, 2001·25 cites·13 claims
- 2850US8304883B2Semiconductor device having multiple semiconductor elementsTAKAHASHI YOSHIMI·Filed 2011·Granted Nov 6, 2012·0 cites·2 claims
- 2950US7884009B2Semiconductor device with an improved solder jointTEXAS INSTRUMENTS INC·Filed 2010·Granted Feb 8, 2011·0 cites·9 claims
- 3048US6713851B1Lead over chip semiconductor device including a heat sink for heat dissipationTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 30, 2004·12 cites·17 claims
- 3146US2008157353A1Control of Standoff Height Between Packages with a Solder-Embedded TapeTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3245US8193085B2Method for fabricating flip-attached and underfilled semiconductor devicesWATANABE MASAKO·Filed 2010·Granted Jun 5, 2012·0 cites·3 claims
- 3345US7679002B2Semiconductive device having improved copper density for package-on-package applicationsTEXAS INSTRUMENTS INC·Filed 2006·Granted Mar 16, 2010·0 cites·11 claims
- 3444US2011024899A1Substrate structure for cavity packageMASUMOTO KENJI·Filed 2009·Application pending·0 cites
- 3544US2005127498A1Copper-based chip attach for chip-scale semiconductor packagesFiled 2005·Application pending·0 cites
- 3642US2010025837A1Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 3742US2010090323A1Composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 3841US2007170599A1Flip-attached and underfilled stacked semiconductor devicesAMAGAI MASAZUMI·Filed 2006·Application pending·0 cites
- 3935US2007243098A1Lead-Free SolderOHNISHI TSUKASA·Filed 2004·Application pending·0 cites
- 4035US2003132520A1Semiconductor device and mounting methodFiled 2003·Application pending·0 cites
- 4134US8598029B2Method for fabricating flip-attached and underfilled semiconductor devicesWATANABE MASAKO·Filed 2012·Granted Dec 3, 2013·0 cites·7 claims
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