Inventor · disambiguated record
Norito Umehara
Also filed as: UMEHARA NORITO
12 granted patents·621 citations·filing 1994–2002
94Inventor score
Top patents by PatentIndex Score
12 records- 0193US5882956AProcess for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1997·Granted Mar 16, 1999·161 cites·9 claims
- 0288US6713881B2Semiconductor device and method of manufacturing sameTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 30, 2004·64 cites·20 claims
- 0388US6007920AWafer dicing/bonding sheet and process for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1998·Granted Dec 28, 1999·92 cites·5 claims
- 0483US5960260ASemiconductor device, its manufacturing method, and dicing adhesive element thereforTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 28, 1999·74 cites·13 claims
- 0580US5920116ARigidized lead frame for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 6, 1999·61 cites·16 claims
- 0679US6118183ASemiconductor device, manufacturing method thereof, and insulating substrate for sameTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 12, 2000·55 cites·16 claims
- 0767US6784022B2Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuitsTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 31, 2004·12 cites·17 claims
- 0863US5623123ASemiconductor device package with small die pad and method of making sameTEXAS INSTRUMENTS INC·Filed 1994·Granted Apr 22, 1997·34 cites·17 claims
- 0960US6380634B1Conductor wires and semiconductor device using themTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 30, 2002·25 cites·16 claims
- 1048US6713851B1Lead over chip semiconductor device including a heat sink for heat dissipationTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 30, 2004·12 cites·17 claims
- 1145US6268644B1Semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 31, 2001·16 cites·10 claims
- 1245US6225703B1Semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1999·Granted May 1, 2001·15 cites·20 claims
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