Inventor · disambiguated record
John G. Davis
Also filed as: DAVIS JOHN · DAVIS JOHN G · DAVIS JOHN GILLETTE
24 granted patents·1 pending application·428 citations·filing 1979–2009
97Inventor score
Top patents by PatentIndex Score
25 records- 0195US7735652B2Apparatus and method for continuous particle separationUNIV PRINCETON·Filed 2007·Granted Jun 15, 2010·78 cites·18 claims
- 0290US6437254B1Apparatus and method for printed circuit board repairIBM·Filed 2001·Granted Aug 20, 2002·46 cites·3 claims
- 0387US6893591B2Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 2002·Granted May 17, 2005·34 cites·9 claims
- 0485US6590285B1Method and composition for mounting an electronic component and device formed therewithIBM·Filed 2000·Granted Jul 8, 2003·28 cites·16 claims
- 0582US6432511B1Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 1997·Granted Aug 13, 2002·49 cites·5 claims
- 0671US5809641AMethod for printed circuit board repairIBM·Filed 1996·Granted Sep 22, 1998·28 cites·6 claims
- 0767US6296173B2Method and apparatus for soldering ball grid array modules to substratesIBM·Filed 2001·Granted Oct 2, 2001·11 cites·5 claims
- 0866US5924622AMethod and apparatus for soldering ball grid array modules to substratesIBM·Filed 1996·Granted Jul 20, 1999·23 cites·7 claims
- 0962US8053683B2Equipment container retention and bonding system and methodLOCKHEED CORP·Filed 2009·Granted Nov 8, 2011·3 cites·24 claims
- 1062US6589376B1Method and composition for mounting an electronic component and device formed therewithIBM·Filed 1998·Granted Jul 8, 2003·19 cites·16 claims
- 1160US5940687AWire mesh insert for thermal adhesivesIBM·Filed 1997·Granted Aug 17, 1999·21 cites·15 claims
- 1258US6332267B1Process of manufacturing a removably interlockable assemblyIBM·Filed 2000·Granted Dec 25, 2001·6 cites·9 claims
- 1354US6039805ATransfer fluxing method and apparatus for component placement on substrateIBM·Filed 1998·Granted Mar 21, 2000·13 cites·11 claims
- 1454US4254898AParticle spacing and metering deviceDAVIS OWEN MICHAEL·Filed 1979·Granted Mar 10, 1981·12 cites·7 claims
- 1553US6043110AWire mesh insert for thermal adhesivesIBM·Filed 1999·Granted Mar 28, 2000·15 cites·6 claims
- 1651US6115912AApparatus and method for printed circuit board repairIBM·Filed 1999·Granted Sep 12, 2000·11 cites·5 claims
- 1748US7150096B1Universal tool for uniformly applying a force to a plurality of components on a circuit boardIBM·Filed 2000·Granted Dec 19, 2006·4 cites·5 claims
- 1847US6179625B1Removable interlockable first and second connectors having engaging flexible members and process of making sameIBM·Filed 1999·Granted Jan 30, 2001·10 cites·2 claims
- 1943US7645410B2Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 2004·Granted Jan 12, 2010·0 cites·4 claims
- 2041US6295724B1Apparatus for printed circuit board repairIBM·Filed 1999·Granted Oct 2, 2001·6 cites·6 claims
- 2141US2004003882A1Method and composition for mounting an electronic component and device formed therewithFiled 2003·Application pending·0 cites
- 2238US6196444B1Method and apparatus for soldering ball grid array modules to substratesIBM·Filed 1999·Granted Mar 6, 2001·6 cites·7 claims
- 2336US6018866AApparatus and method for printed circuit board repairIBM·Filed 1998·Granted Feb 1, 2000·4 cites·10 claims
- 2429US6471117B1Transfer fluxing method and apparatus for component placement on substrateIBM·Filed 1999·Granted Oct 29, 2002·0 cites·13 claims
- 2526US6141866AUniversal tool for uniformly applying a force to a plurality of components on a circuit boardIBM·Filed 1998·Granted Nov 7, 2000·1 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →