Inventor · disambiguated record
Chanapat Kongpoung
Also filed as: KONGPOUNG CHANAPAT
2 granted patents·7 citations·filing 2016–2017
51Inventor score
Files withUTAC HEADQUARTERS PTE LTD2
Top patents by PatentIndex Score
2 records- 0185US10242953B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 26, 2019·7 cites·20 claims
- 0252US10600741B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Mar 24, 2020·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →