Inventor · disambiguated record
Sohrab Safai
Also filed as: SAFAI SOHRAB
10 granted patents·1 pending application·129 citations·filing 1982–2014
89Inventor score
Top patents by PatentIndex Score
11 records- 0179US6328615B1Contact formed of joined piecesITT MFG ENTERPRISES INC·Filed 2000·Granted Dec 11, 2001·30 cites·10 claims
- 0275US9111755B1Bond pad and passivation layer having a gap and method for formingTRAN TU-ANH N·Filed 2014·Granted Aug 18, 2015·4 cites·20 claims
- 0373US4494305AContact extraction toolITT·Filed 1982·Granted Jan 22, 1985·26 cites·9 claims
- 0469US6325669B1Electrical connector sealing systemITT MFG ENTERPRISES INC·Filed 2000·Granted Dec 4, 2001·20 cites·9 claims
- 0567US6879028B2Multi-die semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Apr 12, 2005·15 cites·23 claims
- 0654US6508672B1Joints for filter connectorITT MFG ENTERPRISES INC·Filed 2001·Granted Jan 21, 2003·9 cites·9 claims
- 0751US6971929B2Modular high density connectorITT MFG ENTERPRISES INC·Filed 2004·Granted Dec 6, 2005·6 cites·4 claims
- 0846US5572066ALead-on-chip semiconductor device and method for its fabricationMOTOROLA INC·Filed 1995·Granted Nov 5, 1996·17 cites·14 claims
- 0945US7015585B2Packaged integrated circuit having wire bonds and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 21, 2006·2 cites·8 claims
- 1038US9515034B2Bond pad having a trench and method for formingSAFAI SOHRAB·Filed 2014·Granted Dec 6, 2016·0 cites·20 claims
- 1135US2015194395A1Bond pad having a trench and method for formingSAFAI SOHRAB·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →