Inventor · disambiguated record
Sherif A. Goma
Also filed as: GOMA SHERIF · GOMA SHERIF A · GOMA SHERIF AHMED
21 granted patents·9 pending applications·239 citations·filing 2002–2020
94Inventor score
Top patents by PatentIndex Score
30 records- 0197US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0290US7452212B2Metalized elastomeric electrical contactsIBM·Filed 2005·Granted Nov 18, 2008·16 cites·1 claims
- 0386US7137827B2Interposer with electrical contact button and methodIBM·Filed 2003·Granted Nov 21, 2006·32 cites·1 claims
- 0483US8551816B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2012·Granted Oct 8, 2013·6 cites·6 claims
- 0577US7648369B2Interposer with electrical contact button and methodIBM·Filed 2006·Granted Jan 19, 2010·5 cites·5 claims
- 0676US11170649B2Integrated collision avoidance and road safety management systemIBM·Filed 2020·Granted Nov 9, 2021·2 cites·20 claims
- 0775US7915064B2Processing for overcoming extreme topographyIBM·Filed 2009·Granted Mar 29, 2011·3 cites·3 claims
- 0874US7771208B2Metalized elastomeric electrical contactsIBM·Filed 2008·Granted Aug 10, 2010·5 cites·34 claims
- 0973US8832936B2Method of forming metallized elastomeric electrical contactsHOUGHAM GARETH GEOFFREY·Filed 2009·Granted Sep 16, 2014·5 cites·14 claims
- 1073US8237271B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2007·Granted Aug 7, 2012·5 cites·10 claims
- 1173US6732908B2High density raised stud microjoining system and methods of fabricating the sameIBM·Filed 2002·Granted May 11, 2004·19 cites·15 claims
- 1267US8054095B2Metalized elastomeric probe structureIBM·Filed 2005·Granted Nov 8, 2011·4 cites·38 claims
- 1366US7823278B2Method for fabricating electrical contact buttonsIBM·Filed 2005·Granted Nov 2, 2010·2 cites·21 claims
- 1465US7688095B2Interposer structures and methods of manufacturing the sameIBM·Filed 2007·Granted Mar 30, 2010·2 cites·15 claims
- 1565US7456640B2Structure for coupling probes of probe device to corresponding electrical contacts on product substrateIBM·Filed 2006·Granted Nov 25, 2008·6 cites·20 claims
- 1661US8603846B2Processing for overcoming extreme topographyCOHEN GUY A·Filed 2011·Granted Dec 10, 2013·1 cites·5 claims
- 1760US2014149175A1Financial Risk Analytics for Service ContractsIBM·Filed 2013·Application pending·0 cites
- 1859US2014149174A1Financial Risk Analytics for Service ContractsIBM·Filed 2012·Application pending·0 cites
- 1958US9263292B2Processing for overcoming extreme topographyIBM·Filed 2013·Granted Feb 16, 2016·0 cites·3 claims
- 2057US8159248B2Interposer structures and methods of manufacturing the sameCORDES STEVEN A·Filed 2009·Granted Apr 17, 2012·2 cites·19 claims
- 2156US11341689B1Dynamic virtual audience generationIBM·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2253US2009044405A1Interposer with Electrical Contact Button and MethodHOUGHAM GARETH G·Filed 2008·Application pending·0 cites
- 2346US2009302454A1Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate waferCHENG YU-TING·Filed 2009·Application pending·0 cites
- 2446US2006027934A1Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2005·Application pending·0 cites
- 2543US2006009038A1Processing for overcoming extreme topographyIBM·Filed 2004·Application pending·0 cites
- 2641US2012091585A1Laser release process for very thin si-carrier buildBUCHWALTER LEENA P·Filed 2011·Application pending·0 cites
- 2740US7880305B2Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate waferIBM·Filed 2002·Granted Feb 1, 2011·0 cites·2 claims
- 2839US8187923B2Laser release process for very thin Si-carrier buildANDRY PAUL STEPHEN·Filed 2008·Granted May 29, 2012·0 cites·10 claims
- 2937US2006024861A1Interposer structures and improved processes for use in probe technologies for semiconductor manufacturingIBM·Filed 2004·Application pending·0 cites
- 3036US2008036084A1Laser release process for very thin Si-carrier buildIBM·Filed 2006·Application pending·0 cites
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