Inventor · disambiguated record
Kein Fee Liew
Also filed as: LIEW KEIN FEE
2 granted patents·1 pending application·2 citations·filing 2008–2014
44Inventor score
Technology areasY10T
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0156US8384223B2Backside mold process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2008·Granted Feb 26, 2013·2 cites·9 claims
- 0247US8835220B2Backside mold process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2013·Granted Sep 16, 2014·0 cites·14 claims
- 0347US2015072474A1Backside mold process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2014·Application pending·0 cites
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