Inventor · disambiguated record
Joel Harringa
Also filed as: HARRINGA JOEL · HARRINGA JOEL L · HARRINGA JOEL LEE
9 granted patents·4 pending applications·112 citations·filing 1999–2016
88Inventor score
Files withUNIV IOWA STATE RES FOUND INC8ANDERSON IVER E2IOWA STATE UNIVERSITY RESEACH1RES TRIANGLE INST1US ENERGY1
Top patents by PatentIndex Score
13 records- 0184US6432855B1Superabrasive boride and a method of preparing the same by mechanical alloying and hot pressingIOWA STATE UNIVERSITY RESEACH·Filed 2000·Granted Aug 13, 2002·30 cites·5 claims
- 0283US6099605ASuperabrasive boride and a method of preparing the same by mechanical alloying and hot pressingUNIV IOWA STATE RES FOUND INC·Filed 1999·Granted Aug 8, 2000·40 cites·7 claims
- 0379US7517375B2Wear-resistant boride composites with high percentage of reinforcement phaseUNIV IOWA STATE RES FOUND INC·Filed 2006·Granted Apr 14, 2009·9 cites·15 claims
- 0478US6921422B2Ductile binder phase for use with A1MgB14 and other hard materialsUNIV IOWA STATE RES FOUND INC·Filed 2003·Granted Jul 26, 2005·11 cites·4 claims
- 0571US10294548B1Hard and super-hard metal alloys and methods for making the sameANDERSON IVER E·Filed 2016·Granted May 21, 2019·1 cites·15 claims
- 0670US7172641B2Ultra-hard boride-based metal matrix reinforcementUNIV IOWA STATE RES FOUND INC·Filed 2004·Granted Feb 6, 2007·7 cites·4 claims
- 0768US9437796B2Rare earth-doped materials with enhanced thermoelectric figure of meritRES TRIANGLE INST·Filed 2012·Granted Sep 6, 2016·1 cites·29 claims
- 0867US7238429B2Ultra-hard low friction coating based on A1MgB14 for reduced wear of MEMS and other tribological components and systemUNIV IOWA STATE RES FOUND INC·Filed 2004·Granted Jul 3, 2007·13 cites·14 claims
- 0952US2013280120A1Hard and Super-hard Metal Alloys and Methods for Making the SameUS ENERGY·Filed 2013·Application pending·0 cites
- 1049US10442037B2Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solderUNIV IOWA STATE RES FOUND INC·Filed 2015·Granted Oct 15, 2019·0 cites·3 claims
- 1146US2011303448A1Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al SolderANDERSON IVER E·Filed 2011·Application pending·0 cites
- 1244US2010203353A1Pb-Free Sn-Ag-Cu-Mn SolderUNIV IOWA STATE RES FOUND INC·Filed 2009·Application pending·0 cites
- 1340US2017095891A1Lead-free composite solderUNIV IOWA STATE RES FOUND INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →