Inventor · disambiguated record
Valluri Rao
Also filed as: RAO VALLURI · RAO VALLURI R · RAO VALLURI R M · RAO VALLURI RAMANA
52 granted patents·20 pending applications·1,175 citations·filing 1987–2023
98Inventor score
Top patents by PatentIndex Score
72 records- 0199US6448168B1Method for distributing a clock on the silicon backside of an integrated circuitINTEL CORP·Filed 2000·Granted Sep 10, 2002·382 cites·13 claims
- 0297US11222863B2Techniques for die stacking and associated configurationsINTEL CORP·Filed 2016·Granted Jan 11, 2022·21 cites·16 claims
- 0397US10615133B2Die package with superposer substrate for passive componentsINTEL CORP·Filed 2013·Granted Apr 7, 2020·22 cites·17 claims
- 0496US10872820B2Integrated circuit structuresINTEL CORP·Filed 2017·Granted Dec 22, 2020·22 cites·11 claims
- 0595US10658312B2Embedded millimeter-wave phased array moduleINTEL CORP·Filed 2017·Granted May 19, 2020·11 cites·13 claims
- 0695US6848177B2Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeINTEL CORP·Filed 2002·Granted Feb 1, 2005·86 cites·20 claims
- 0795US6222246B1Flip-chip having an on-chip decoupling capacitorINTEL CORP·Filed 1999·Granted Apr 24, 2001·106 cites·17 claims
- 0894US8759950B2Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making sameKAMGAING TELESPHOR·Filed 2011·Granted Jun 24, 2014·22 cites·11 claims
- 0993US9773742B2Embedded millimeter-wave phased array moduleINTEL CORP·Filed 2013·Granted Sep 26, 2017·15 cites·15 claims
- 1091US8816906B2Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substratesKAMGAING TELESPHOR·Filed 2011·Granted Aug 26, 2014·14 cites·27 claims
- 1187US9229466B2Fully integrated voltage regulators for multi-stack integrated circuit architecturesSARASWAT RUCHIR·Filed 2011·Granted Jan 5, 2016·11 cites·25 claims
- 1286US6037822AMethod and apparatus for distributing a clock on the silicon backside of an integrated circuitINTEL CORP·Filed 1997·Granted Mar 14, 2000·71 cites·9 claims
- 1385US9166284B2Package structures including discrete antennas assembled on a deviceINTEL CORP·Filed 2012·Granted Oct 20, 2015·6 cites·46 claims
- 1484US10134727B2High breakdown voltage III-N depletion mode MOS capacitorsINTEL CORP·Filed 2015·Granted Nov 20, 2018·4 cites·23 claims
- 1583US9297824B2Techniques, systems and devices related to acceleration measurementMA QING·Filed 2012·Granted Mar 29, 2016·4 cites·16 claims
- 1682US9064709B2High breakdown voltage III-N depletion mode MOS capacitorsTHEN HAN WUI·Filed 2012·Granted Jun 23, 2015·6 cites·25 claims
- 1782US6316981B1Signal distribution network on backside of substrateINTEL CORP·Filed 2000·Granted Nov 13, 2001·23 cites·7 claims
- 1881US4980019AEtch-back process for failure analysis of integrated circuitsINTEL CORP·Filed 1989·Granted Dec 25, 1990·28 cites·8 claims
- 1980US7626846B2Method and media for improving ferroelectric domain stability in an information storage deviceNANOCHIP INC·Filed 2007·Granted Dec 1, 2009·18 cites·16 claims
- 2080US4766372AElectron beam testerINTEL CORP·Filed 1987·Granted Aug 23, 1988·25 cites·30 claims
- 2179US7307331B2Integrated radio front-end module with embedded circuit elementsINTEL CORP·Filed 2004·Granted Dec 11, 2007·26 cites·20 claims
- 2278US10290614B2Group III-N transistors for system on chip (SOC) architecture integrating power management and radio frequency circuitsTHEN HAN WUI·Filed 2011·Granted May 14, 2019·4 cites·4 claims
- 2376US2024194533A1Integrated circuit device structures and double-sided electrical testingINTEL CORP·Filed 2023·Application pending·0 cites
- 2475US7112887B2Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeINTEL CORP·Filed 2004·Granted Sep 26, 2006·15 cites·4 claims
- 2575US5969517AApparatus for performing quantitative measurement of DC and AC current flow in integrated circuit interconnects by measurement of magnetic fields with a magneto optic laser probeINTEL CORP·Filed 1998·Granted Oct 19, 1999·32 cites·15 claims
- 2674US10453679B2Methods and devices integrating III-N transistor circuitry with Si transistor circuitryINTEL CORP·Filed 2015·Granted Oct 22, 2019·2 cites·16 claims
- 2774US6084396AMethod for performing quantitative measurement of DC and AC current flow in integrated circuit interconnects by the measurement of magnetic fields with a magneto optic laser probeINTEL CORP·Filed 1996·Granted Jul 4, 2000·30 cites·19 claims
- 2873US5952247AMethod of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrateINTEL CORP·Filed 1996·Granted Sep 14, 1999·34 cites·63 claims
- 2972US7514942B2Probe based patterning of microelectronic and micromechanical devicesINTEL CORP·Filed 2006·Granted Apr 7, 2009·4 cites·20 claims
- 3071US5805421ASemiconductor substrate having alignment marks for locating circuitry on the substrateINTEL CORP·Filed 1997·Granted Sep 8, 1998·30 cites·20 claims
- 3170US11854894B2Integrated circuit device structures and double-sided electrical testingINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·8 claims
- 3270US7167135B2MEMS based tunable antenna for wireless reception and transmissionINTEL CORP·Filed 2004·Granted Jan 23, 2007·13 cites·13 claims
- 3369US8264941B2Arrangement and method to perform scanning readout of ferroelectric bit chargesTRAN QUAN ANH·Filed 2007·Granted Sep 11, 2012·4 cites·31 claims
- 3469US8149680B2Random read/write performance of probe storage memory devicesRAO VALLURI R·Filed 2009·Granted Apr 3, 2012·2 cites·4 claims
- 3567US10763248B2Multi-layer silicon/gallium nitride semiconductorINTEL CORP·Filed 2015·Granted Sep 1, 2020·1 cites·24 claims
- 3666US10943836B2Gallium nitride NMOS on Si (111) co-integrated with a silicon PMOSINTEL CORP·Filed 2020·Granted Mar 9, 2021·0 cites·18 claims
- 3766US9419339B2Package structures including discrete antennas assembled on a deviceINTEL CORP·Filed 2015·Granted Aug 16, 2016·1 cites·16 claims
- 3865US9881990B2Integrated inductor for integrated circuit devicesINTEL CORP·Filed 2016·Granted Jan 30, 2018·1 cites·13 claims
- 3964US10600787B2Silicon PMOS with gallium nitride NMOS for voltage regulationINTEL CORP·Filed 2016·Granted Mar 24, 2020·1 cites·25 claims
- 4064US9653805B2Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substratesINTEL CORP·Filed 2014·Granted May 16, 2017·1 cites·38 claims
- 4164US7312505B2Semiconductor substrate with interconnections and embedded circuit elementsINTEL CORP·Filed 2004·Granted Dec 25, 2007·11 cites·22 claims
- 4258US8072016B2EPI substrate with low doped EPI layer and high doped Si substrate layer for media growth on EPI and low contact resistance to back-side substrateJAIN AJAY·Filed 2008·Granted Dec 6, 2011·0 cites·19 claims
- 4357US11532601B2Group III-N transistors for system on chip (SOC) architecture integrating power management and radio frequency circuitsINTEL CORP·Filed 2019·Granted Dec 20, 2022·0 cites·18 claims
- 4456US5976980AMethod and apparatus providing a mechanical probe structure in an integrated circuit dieINTEL CORP·Filed 1997·Granted Nov 2, 1999·20 cites·23 claims
- 4555US5904486AMethod for performing a circuit edit through the back side of an integrated circuit dieINTEL CORP·Filed 1997·Granted May 18, 1999·17 cites·22 claims
- 4652US10707136B2Gallium nitride NMOS on Si (111) co-integrated with a silicon PMOSINTEL CORP·Filed 2016·Granted Jul 7, 2020·0 cites·25 claims
- 4752US10256286B2Integrated inductor for integrated circuit devicesINTEL CORP·Filed 2017·Granted Apr 9, 2019·0 cites·10 claims
- 4852US2013003521A1Arrangement and method to perform scanning readout of ferroelectric bit chargesINTEL CORP·Filed 2012·Application pending·0 cites
- 4950US2009001338A1Seek-and-scan probe memory devices with nanostructures for improved bit size and resistance contrast when reading and writing to phase-change mediaFRANKLIN NATHAN·Filed 2007·Application pending·0 cites
- 5048US6150718AMethod and apparatus for performing a circuit edit through the back side of an integrated circuit dieINTEL CORP·Filed 1999·Granted Nov 21, 2000·12 cites·3 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →