Inventor · disambiguated record
Qianfa Liu
Also filed as: LIU QIANFA
8 granted patents·4 pending applications·1 citations·filing 2011–2022
72Inventor score
Top patents by PatentIndex Score
12 records- 0181US11053352B2Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·17 claims
- 0274US12466937B2Resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 0364US12378386B2Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·16 claims
- 0461US11261305B2Thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 0557US11945924B2Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·14 claims
- 0654US2024010810A1Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 0752US2023202126A1Low dielectric loss non-woven fabric, preparation method thereof and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 0846US2025368791A1Non-woven fabric prepreg, metal-foil-clad plate and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 0941US11744013B2Composite, high-frequency circuit substrate prepared therefrom and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Aug 29, 2023·0 cites·13 claims
- 1040US2014377534A1Circuit substrate and manufacturing method thereofSHENGYI TECHNOLOGY CO LTD·Filed 2011·Application pending·0 cites
- 1138US9744745B2Circuit substrate and manufacturing method thereofSU MINSHE·Filed 2011·Granted Aug 29, 2017·0 cites·16 claims
- 1237US10400058B2Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereofSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Sep 3, 2019·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →