Inventor · disambiguated record
Jonathan W. Thibado
Also filed as: THIBADO JONATHAN · THIBADO JONATHAN W · THIBADO JONATHAN WILLIAM
11 granted patents·8 pending applications·22 citations·filing 2002–2021
83Inventor score
Top patents by PatentIndex Score
19 records- 0194US10880994B2Top-side connector interface for processor packagingINTEL CORP·Filed 2016·Granted Dec 29, 2020·13 cites·13 claims
- 0287US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 0366US9603276B2Electronic assembly that includes a plurality of electronic packagesINTEL CORP·Filed 2014·Granted Mar 21, 2017·1 cites·22 claims
- 0465US11683890B2Reflow grid array to support late attach of componentsINTEL CORP·Filed 2018·Granted Jun 20, 2023·1 cites·24 claims
- 0562US12219706B2Removable and low insertion force connector systemINTEL CORP·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 0659US2021120668A1Top-side connector interface for processor packagingINTEL CORP·Filed 2020·Application pending·0 cites
- 0753US11545408B2Reflowable grid array to support grid heatingINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·24 claims
- 0852US2018352649A1Connector interface for processor packagingINTEL CORP·Filed 2016·Application pending·0 cites
- 0951US12082370B2System device aggregation in a liquid cooling environmentINTEL CORP·Filed 2021·Granted Sep 3, 2024·0 cites·25 claims
- 1049US2018007791A1Cpu package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2017·Application pending·0 cites
- 1147US2016351526A1Integrated circuit chip attachment using local heat sourceINTEL CORP·Filed 2014·Application pending·0 cites
- 1246US11621237B2Interposer and electronic packageINTEL CORP·Filed 2019·Granted Apr 4, 2023·0 cites·23 claims
- 1345US11488839B2Reflowable grid array as standby heater for reliabilityINTEL CORP·Filed 2019·Granted Nov 1, 2022·0 cites·24 claims
- 1445US11023247B2Processor package with optimization based on package connection typeINTEL CORP·Filed 2018·Granted Jun 1, 2021·0 cites·29 claims
- 1543US10211120B2Rework grid array interposer with direct powerINTEL CORP·Filed 2015·Granted Feb 19, 2019·0 cites·21 claims
- 1638US2016190716A1Socket that engages a plurality of electronic packagesLIU KUANG·Filed 2014·Application pending·0 cites
- 1734US2004040575A1Brush for cleaning/scrubbing a substrateFiled 2002·Application pending·0 cites
- 1832US2017178994A1Integrated circuit package support structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1927US2017179066A1Bulk solder removal on processor packagingAOKI RUSSELL S·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →