Inventor · disambiguated record
John Holmes
Also filed as: HOLMES JOHN · HOLMES JOHN A · HOLMES JOHN P · HOLMES John Patrick
6 granted patents·5 pending applications·42 citations·filing 1977–2023
78Inventor score
Top patents by PatentIndex Score
11 records- 0187US10002857B2Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layerQUALCOMM INC·Filed 2016·Granted Jun 19, 2018·10 cites·34 claims
- 0274US11404343B2Package comprising a substrate configured as a heat spreaderQUALCOMM INC·Filed 2020·Granted Aug 2, 2022·1 cites·30 claims
- 0360US12512412B2Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2023·Granted Dec 30, 2025·0 cites·29 claims
- 0459US4143476ADevice for arranging and transporting articles of laundryHOSPITAL LINEN SERVICE FACILIT·Filed 1977·Granted Mar 13, 1979·22 cites·7 claims
- 0556US11417622B2Flip-chip deviceQUALCOMM INC·Filed 2020·Granted Aug 16, 2022·0 cites·30 claims
- 0654US2024071993A1Package comprising a chiplet located between two metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0754US2024072032A1Package comprising a chiplet located between an integrated device and a metallization portionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0841US2011195223A1Asymmetric Front/Back Solder MaskQUALCOMM INC·Filed 2010·Application pending·0 cites
- 0935US4612104AElectrochemical cellCOGENT LTD·Filed 1984·Granted Sep 16, 1986·9 cites·6 claims
- 1033US2017271175A1Exposed die mold underfill (muf) with fine pitch copper (cu) pillar assembly and bump densityQUALCOMM INC·Filed 2017·Application pending·0 cites
- 1132US2006284930A1Methods and arrangements for adjusting and aligning fluid dispensing devices and the like such as continuous ink jet printheadsMEJALLI GEORGE·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →