Inventor · disambiguated record
Yoshihiro Kamiyama
Also filed as: KAMIYAMA YOSHIHIRO
21 granted patents·25 citations·filing 2015–2018
90Inventor score
Technology areasH10W
Files withSHINDENGEN ELECTRIC MFG21
Top patents by PatentIndex Score
21 records- 0181US9966327B2Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2015·Granted May 8, 2018·4 cites·4 claims
- 0278US10832994B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Nov 10, 2020·3 cites·6 claims
- 0376US10553523B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Feb 4, 2020·3 cites·7 claims
- 0476US9673143B2Semiconductor device and manufacturing method of the sameSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Jun 6, 2017·3 cites·8 claims
- 0563USD877102SSemiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Mar 3, 2020·9 cites·1 claims
- 0661US11183943B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Nov 23, 2021·1 cites·15 claims
- 0761US11101204B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Aug 24, 2021·1 cites·15 claims
- 0861US10103096B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Oct 16, 2018·1 cites·10 claims
- 0946US11309274B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Apr 19, 2022·0 cites·13 claims
- 1045US11227816B2Electronic module with press hole to expose surface of a conductorSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jan 18, 2022·0 cites·10 claims
- 1144US11227810B2Electronic module with a groove and press hole on the surface of a conductorSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jan 18, 2022·0 cites·9 claims
- 1240US11145576B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Oct 12, 2021·0 cites·8 claims
- 1338US11515253B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Nov 29, 2022·0 cites·13 claims
- 1438US11165363B2Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Nov 2, 2021·0 cites·15 claims
- 1537US11688714B2Semiconductor package with three leadsSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jun 27, 2023·0 cites·9 claims
- 1637US10985092B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Apr 20, 2021·0 cites·11 claims
- 1737US10490490B2Thermally conductive semiconductor device and manufacturing method thereofSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Nov 26, 2019·0 cites·14 claims
- 1837US10453779B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Oct 22, 2019·0 cites·13 claims
- 1936US11462974B2Semiconductor moduleSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Oct 4, 2022·0 cites·15 claims
- 2036US10453781B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Oct 22, 2019·0 cites·9 claims
- 2135US10438872B2Semiconductor device and lead frameSHINDENGEN ELECTRIC MFG·Filed 2016·Granted Oct 8, 2019·0 cites·15 claims
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