Inventor · disambiguated record
Shin Choi
Also filed as: CHOI SHIN · CHOI SHIN GYU
7 granted patents·3 pending applications·53 citations·filing 1998–2012
82Inventor score
Top patents by PatentIndex Score
10 records- 0167US6972496B2Chip-scaled package having a sealed connection wireHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Dec 6, 2005·16 cites·10 claims
- 0261US6969906B2Multi-chip package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2004·Granted Nov 29, 2005·9 cites·12 claims
- 0355US7883965B2Semiconductor device and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Feb 8, 2011·1 cites·20 claims
- 0454US6198164B1Ultra high density integrated circuit semiconductor package and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 1998·Granted Mar 6, 2001·22 cites·8 claims
- 0552US6724090B2Multi-chip package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2003·Granted Apr 20, 2004·5 cites·10 claims
- 0646US7892944B2Method of forming transistor in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Feb 22, 2011·0 cites·6 claims
- 0742US2010129979A1Semiconductor device having increased active region width and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 0841US2009108395A1Semiconductor device having increased active region width and method for manufacturing the sameCHOI SHIN GYU·Filed 2008·Application pending·0 cites
- 0938US8933509B2Semiconductor device and method for fabricating the sameCHOI SHIN GYU·Filed 2011·Granted Jan 13, 2015·0 cites·17 claims
- 1038US2013320438A1Semiconductor device and method for manufacturing the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
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