Inventor · disambiguated record
Terry Mcmahon
Also filed as: MCMAHON TERRY · MCMAHON TERRY E
44 granted patents·3 pending applications·278 citations·filing 2001–2024
97Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO34HEWLETT PACKARD DEVELOPMENT CO LP4CHEN CHIEN-HUA1CHEN ZHIZHANG1GOVYADINOV ALEXANDER1
Top patents by PatentIndex Score
47 records- 0196US7713456B2Drop generator die processingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted May 11, 2010·32 cites·2 claims
- 0294US8336981B2Determining a healthy fluid ejection nozzleCHEN CHIEN-HUA·Filed 2009·Granted Dec 25, 2012·24 cites·11 claims
- 0390US6627467B2Fluid ejection device fabricationHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Sep 30, 2003·36 cites·23 claims
- 0487US7490924B2Drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Feb 17, 2009·38 cites·16 claims
- 0586US6448100B1Method for fabricating self-aligned field emitter tipsHEWLETT PACKARD COMPNAY·Filed 2001·Granted Sep 10, 2002·26 cites·18 claims
- 0685US6698868B2Thermal drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Mar 2, 2004·27 cites·9 claims
- 0781US12358243B2Printing conductive elementsPERIDOT PRINT LLC·Filed 2024·Granted Jul 15, 2025·0 cites·6 claims
- 0880US7282448B2Substrate and method of forming substrate for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Oct 16, 2007·3 cites·36 claims
- 0979US6882100B2Dielectric light deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 19, 2005·12 cites·46 claims
- 1078US6960978B2Fuse structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 1, 2005·23 cites·22 claims
- 1176US11667128B2Fluidic die with monitoring circuit fault protection structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 6, 2023·2 cites·15 claims
- 1276US6981759B2Substrate and method forming substrate for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 3, 2006·9 cites·23 claims
- 1374US10933634B2Conductive wire disposed in a layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 2, 2021·1 cites·18 claims
- 1470US10675867B2Thermal inkjet resistor circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 9, 2020·0 cites·13 claims
- 1570US7125731B2Drop generator for ultra-small dropletsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Oct 24, 2006·10 cites·18 claims
- 1669US9707586B2Printhead with recessed slot endsRIVAS RIO·Filed 2012·Granted Jul 18, 2017·1 cites·20 claims
- 1769US8770707B2Drop detector assembly and methodGOVYADINOV ALEXANDER·Filed 2010·Granted Jul 8, 2014·1 cites·14 claims
- 1869US7078855B2Dielectric light deviceCHEN ZHIZHANG·Filed 2005·Granted Jul 18, 2006·2 cites·36 claims
- 1966US7798611B2Circuit routing for printhead having increased corrosion resistanceHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Sep 21, 2010·2 cites·3 claims
- 2062US10369788B2Printhead with recessed slot endsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Aug 6, 2019·0 cites·20 claims
- 2160US10272671B2Isolating failed resistorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Apr 30, 2019·0 cites·13 claims
- 2260US7543917B2Integrated circuit and method for manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jun 9, 2009·1 cites·28 claims
- 2360US6954297B2Micro-mirror device including dielectrophoretic liquidHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Oct 11, 2005·11 cites·38 claims
- 2459US2021170678A1Printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 2558US9782969B2Thermal inkjet printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2017·Granted Oct 10, 2017·0 cites·20 claims
- 2657US11225070B2Fluidic dies with beveled edges underneath electrical leadsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 18, 2022·0 cites·20 claims
- 2755US10752015B2Dissipating heat of heating elementsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Aug 25, 2020·0 cites·20 claims
- 2854US11173708B2Fluidic die with monitoring circuit fault protectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 16, 2021·0 cites·15 claims
- 2953US9630410B2Thermal inkjet printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Apr 25, 2017·0 cites·13 claims
- 3053US6885083B2Drop generator die processingHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 26, 2005·4 cites·10 claims
- 3151US11214060B2Gaps between electrically conductive ground structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jan 4, 2022·0 cites·17 claims
- 3251US9259932B2Assembly to selectively etch at inkjet printheadWHITE LAWRENCE H·Filed 2011·Granted Feb 16, 2016·1 cites·1 claims
- 3351US6972882B2Micro-mirror device with light angle amplificationHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Dec 6, 2005·9 cites·50 claims
- 3450US7669314B2Method of fabricating a fluid ejection device having a data storage structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Mar 2, 2010·0 cites·9 claims
- 3547US7209027B2Fuse structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 24, 2007·0 cites·9 claims
- 3646US10814629B2Termination ring with gapped metallic layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Oct 27, 2020·0 cites·15 claims
- 3746US9570384B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2015·Granted Feb 14, 2017·0 cites·14 claims
- 3846US7924597B2Data storage in circuit elements with changed resistanceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Apr 12, 2011·0 cites·18 claims
- 3946US7170387B2Fuse structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jan 30, 2007·0 cites·4 claims
- 4043US10421275B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Sep 24, 2019·0 cites·17 claims
- 4141US7249825B2Fluid ejection device with data storage structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 31, 2007·1 cites·13 claims
- 4241US7150516B2Integrated circuit and method for manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 19, 2006·1 cites·21 claims
- 4340US7083265B2Circuit routing for printhead having increased corrosion resistanceHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Aug 1, 2006·1 cites·13 claims
- 4439US6933237B2Substrate etch method and deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Aug 23, 2005·0 cites·43 claims
- 4536US7679426B2Transistor antifuse deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 16, 2010·0 cites·51 claims
- 4636US2003202264A1Micro-mirror deviceFiled 2002·Application pending·0 cites
- 4736US2002185947A1Micro ion pump for a low-pressure microdevice microenclosureFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →