Inventor · disambiguated record
Pasi Raappana
Also filed as: RAAPPANA PASI
18 granted patents·3 pending applications·78 citations·filing 2014–2021
92Inventor score
Files withTACTOTEK OY21
Top patents by PatentIndex Score
21 records- 0196US10575407B2System for carrying out a manufacturing method on an electro chemical structureTACTOTEK OY·Filed 2018·Granted Feb 25, 2020·11 cites·3 claims
- 0296US10194526B1Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the nodeTACTOTEK OY·Filed 2018·Granted Jan 29, 2019·19 cites·18 claims
- 0395US10225932B1Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangementTACTOTEK OY·Filed 2018·Granted Mar 5, 2019·20 cites·20 claims
- 0494US9724869B2Multilayer structure for accommodating electronics and related method of manufactureTACTOTEK OY·Filed 2014·Granted Aug 8, 2017·18 cites·21 claims
- 0587US10660211B2Method for manufacturing an electromechanical structureTACTOTEK OY·Filed 2014·Granted May 19, 2020·4 cites·15 claims
- 0683US10248277B2Multilayer structure with embedded multilayer electronicsTACTOTEK OY·Filed 2018·Granted Apr 2, 2019·3 cites·19 claims
- 0781US11516920B2Method for manufacturing an electromechanical structure and an arrangement for carrying out the methodTACTOTEK OY·Filed 2021·Granted Nov 29, 2022·0 cites·14 claims
- 0880US11166363B2Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical nodeTACTOTEK OY·Filed 2019·Granted Nov 2, 2021·2 cites·22 claims
- 0978US11406021B2System for manufacturing an electromechanical structureTACTOTEK OY·Filed 2021·Granted Aug 2, 2022·0 cites·20 claims
- 1074US11363720B2System for manufacturing an electromechanical structureTACTOTEK OY·Filed 2020·Granted Jun 14, 2022·0 cites·10 claims
- 1173US10813222B2System for manufacturing an electromechanical structureTACTOTEK OY·Filed 2020·Granted Oct 20, 2020·0 cites·18 claims
- 1268US10986735B2Method for manufacturing an electromechanical structure and an arrangement for carrying out the methodTACTOTEK OY·Filed 2018·Granted Apr 20, 2021·0 cites·14 claims
- 1367US10986734B2Method for manufacturing an electromechanical structure and an arrangement for carrying out the methodTACTOTEK OY·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 1467US9801286B2Multilayer structure and related method of manufacture for electronicsTACTOTEK OY·Filed 2016·Granted Oct 24, 2017·1 cites·13 claims
- 1565US11166364B2Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical nodeTACTOTEK OY·Filed 2020·Granted Nov 2, 2021·0 cites·19 claims
- 1665US10986733B2Method for manufacturing an electromechanical structureTACTOTEK OY·Filed 2017·Granted Apr 20, 2021·0 cites·23 claims
- 1761US10285261B1Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the nodeTACTOTEK OY·Filed 2018·Granted May 7, 2019·0 cites·27 claims
- 1858US2015257278A1Method for manufacturing electronic products, related arrangement and productTACTOTEK OY·Filed 2014·Application pending·0 cites
- 1955US10642433B2Multilayer structure with embedded multilayer electronicsTACTOTEK OY·Filed 2019·Granted May 5, 2020·0 cites·17 claims
- 2048US2019090353A1Method for manufacturing electronic products, related arrangement and productTACTOTEK OY·Filed 2018·Application pending·0 cites
- 2139US2017094800A1Method and arrangement for providing electrical connection to in-mold electronicsTACTOTEK OY·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →